Surface Analysis (KLA/Tencor Surfscan)

Surface Analysis (KLA/Tencor Surfscan) Location Bay 5 Tool Type Inspection, Test and Characterization Manufacturer KLA/Tencor Description Surface Analysis Primary Supervisor Biljana Stamenic (805) 893-4002 biljana@ece.ucsb.edu Secondary Supervisor Don Freeborn Recipes

About

This system uses a laser-based scattering method to count size and distribution of particles (or other scattering defects) on a flat wafer surface.

It can scan wafers in size from 4 to 8 inches. Piece-parts are more difficult but can be scanned with a custom recipe.

4-inch wafers are the most standard size to measure.

For measuring very low particle counts accurately, purchase "low particle count" (LPC) wafers from a Silicon wafer vendor, and keep the wafers in the case and clean at all times until use.

Documentation

Operating Procedures

• Wafer Scanning Instructions
  • This is the procedure Staff uses to calibrate particle counts on our deposition tools. After the scan is complete you need to press ENTER on a small laptop. The Data will be saved on: Desktop/Local Disk(C)/Users/Public/Public Documentation] The data will be saved as a photo.

• Surfscan instructions [wafers different size, and pieces]
• Surfscan SOP for small substrates (You must water-mount your small sample or wafer (2inch or 3 inch) to a carrier wafer)

• Surfscan SOP for 4inch wafers

• Surfscan SOP for 6inch wafers

• Surfscan SOP for 8inch wafers

• Wafer Particle Count - Process Traveler- Very detailed instructions

Other Documentation

• Operations Manual
  • For detailed measurement info, it is highly recommended that you read the manual.

• Glossary
• Common Errors & Workarounds

Examples

A low-particle 4-inch wafer example:

Gain 4: Small Particles (0.160µm – 1.60µm)	Gain 2: Large Particles (1.60µm – 28.0µm)

A high-particle 4-inch wafer example:

Gain 4: Small Particles (0.160µm – 1.60µm)	Gain 2: Large Particles (1.60µm – 28.0µm)