Dry Etching Recipes

Process Control Data

See above linked page for process control data (dep rate/stress etc. over time), for a selection of often-used dry etches

Dry Etching Tools/Materials Table

Process Maturity Ranking

• R6 - most mature process with regular calibrations recorded on SPC charts.
• …
• R1 - least mature - only run once ever.

The Key/Legend for this table's A...R6 values is at the bottom of the page.

Dry Etching Recipes
	RIE Etching		ICP Etching					Oxygen Plasma Systems				Other Dry Etchers
Material	RIE 2 (MRC)	RIE 5 (PlasmaTherm)	DSEIII (PlasmaTherm)	Fluorine ICP (PlasmaTherm)	ICP Etch 1 (Panasonic E646V)	ICP Etch 2 (Panasonic E626I)	Oxford ICP (PlasmaPro 100)	Ashers (Technics PEII)	Plasma Clean (YES EcoClean)	UV Ozone Reactor	Plasma Activation (EVG 810)	XeF2 Etch (Xetch)	Vapor HF Etch (uETCH)	CAIBE (Oxford)
Ag														R1
Al		R2			R1	R2								R1
Au														R3
Cr		R2			R1	R1								R1
Cu														R1
Ge					A	R1						R2		R1
Mo														R1
Nb					A	R1
Ni														R3
Os					A	R1
Pt														R3
Ru					A	R3								R1
Si			R6	R6			R1					R3		R1
Ta					A	R1								R1
Ti					R1	R1								R1
W				R3	R1	R1								R1
TiW				R3		R1
Al2O3					A	R3								R1
Al2O3 (Sapphire)					R1	R1								R1
AlGaAs		R3			R1		R3							R1
AlGaN							R2							R1
AlN														R1
BCB					A
CdZnTe	R3													R1
GaAs		R3			R1	R6	R3							R1
GaN		R3			R1	R1	R6							R1
GaSb					A	R1	R1							R1
HfO2														R1
InGaAlAs	R3						R1							R1
InGaAsP	R3						R3							R1
InP	R3				A	R1	R6							R3
ITO	R3													R1
LiNbO3														R1
Photoresist & Organics		R3		R3	R3	R3		R3	R3	R3				R1
ARC (Anti Reflective Coating)				R3
SiC					R1	R1								R1
SiN				R3	R1	R3		R3						R1
SiO2				R6	R1	R6							R3	R1
SiOxNy					A	R1								R1
SU8					A
Ta2O5					A	R1								R1
TiN														R1
TiO2														R1
ZnO2														R1
ZnS	R3													R1
ZnSe	R2													R1
ZrO2														R1
Material	RIE 2 (MRC)	RIE 5 (PlasmaTherm)	DSEIII (PlasmaTherm)	Fluorine ICP (PlasmaTherm)	ICP Etch 1 (Panasonic E626I)	ICP Etch 2 (Panasonic E640)	Oxford ICP (PlasmaPro 100)	Ashers (Technics PEII)	Plasma Clean (YES EcoClean)	UV Ozone Reactor	Plasma Activation (EVG 810)	XeF2 Etch (Xetch)	Vapor HF Etch (uETCH)	CAIBE (Oxford)

Process Ranking Table

Processes in the table above are ranked by their "Process Maturity Level" as follows:

Process Level	Description of Process Level Ranking
A	Process Allowed and materials available but never done
R1	Process has been ran at least once
R2	Process has been ran and procedure is documented
R3	Process has been ran, procedure is documented, and data is available
R4	Process has a documented procedure with regular (≥4x per year) data no in-Situ control available
R5	Process has a documented procedure with regular (≥4x per year) data and in-Situ control available
R6	Process has a documented procedure and control charts/limits available.  Controlled process.