Sputtering Recipes: Difference between revisions

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*{{fl|IBD-SiO2-Recipe.pdf|Recipe: SiO{{Sub|2}}_dep}}
*{{fl|IBD-SiO2-Recipe.pdf|Recipe: SiO{{Sub|2}}_dep}}


==SiN deposition (IBD)==
==Si<sub>3</sub>N<sub>4</sub> deposition (IBD)==
* Refractive Index ≈ 2.01
* Refractive Index ≈ 2.01
* Rate ≈ 4.5nm/min (users must calibrate this prior to critical deps)
* Rate ≈ 4.5nm/min (users must calibrate this prior to critical deps)

Revision as of 20:12, 13 August 2013

Back to Vacuum Deposition Recipes.

Sputter 1 (Custom)

Sputter 2 (SFI Endeavor)

Sputter 3 (AJA ATC 2000-F)

Sputter 4 (AJA ATC 2200-V)

Sputter 5 (Lesker AXXIS)

Ion Beam Deposition (Veeco NEXUS)

IBD Calibrations Spreadsheet - Records of historical film depositions (rates, indices), Uniformity etc. All users are required to enter their calibration deps (simple test deps only)

SiO2 deposition (IBD)

  • Refractive Index: ≈1.485
  • Rate: ≈6.1nm/min (users must calibrate this prior to critical deps)
  • Stress ≈ -320MPa (compressive)

Si3N4 deposition (IBD)

  • Refractive Index ≈ 2.01
  • Rate ≈ 4.5nm/min (users must calibrate this prior to critical deps)
  • Stress ≈ -1756MPa (compressive)

Ta2O5 deposition (IBD)

  • Refractive Index ≈ 2.10
  • Rate ≈7.8nm/min (users must calibrate this prior to critical deps)
  • Stress ≈ -140MPa (compressive)

TiO2 deposition (IBD)