Sputtering Recipes: Difference between revisions
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* Stress ≈ -1756MPa (compressive) |
* Stress ≈ -1756MPa (compressive) |
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*{{fl| |
*{{fl|File:Web_Operational_Procedure_EB4_Rev_3.pdf|Recipe: SiN_dep}} |
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*{{fl|SiNfilm.pdf|SiN Film Data (IBD)}} |
*{{fl|SiNfilm.pdf|SiN Film Data (IBD)}} |
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*{{fl|SiNrecipedetails.pdf|SiN Recipe Details (IBD)}} |
*{{fl|SiNrecipedetails.pdf|SiN Recipe Details (IBD)}} |
Revision as of 17:19, 16 August 2013
Back to Vacuum Deposition Recipes.
Sputter 1 (Custom)
Sputter 2 (SFI Endeavor)
Sputter 3 (AJA ATC 2000-F)
Sputter 4 (AJA ATC 2200-V)
Sputter 5 (Lesker AXXIS)
Ion Beam Deposition (Veeco NEXUS)
IBD Calibrations Spreadsheet - Records of historical film depositions (rates, indices), Uniformity etc.
All users are required to enter their calibration deps (simple test deps only)
SiO2 deposition (IBD)
- Refractive Index: ≈1.485
- Rate: ≈6.1nm/min (users must calibrate this prior to critical deps)
- Stress ≈ -320MPa (compressive)
Si3N4 deposition (IBD)
- Refractive Index ≈ 2.01
- Rate ≈ 4.5nm/min (users must calibrate this prior to critical deps)
- Stress ≈ -1756MPa (compressive)
Ta2O5 deposition (IBD)
- Refractive Index ≈ 2.10
- Rate ≈7.8nm/min (users must calibrate this prior to critical deps)
- Stress ≈ -140MPa (compressive)
TiO2 deposition (IBD)
- Refractive Index ≈ 2.3-2.4
- Rate ≈ 1.8nm/min
- Recipe: TiO2_dep