Dry Etching Recipes: Difference between revisions

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Dry Etching Recipes
	RIE Etching				ICP Etching				Oxygen Plasma Systems				Other Dry Etchers
Material	RIE 1 (Custom)	RIE 2 (MRC)	RIE 3 (MRC)	RIE 5 (PlasmaTherm)	Si Deep RIE (PlasmaTherm/Bosch Etch)	ICP Etch 1 (Panasonic E626I)	ICP Etch 2 (Panasonic E640)	ICP-Etch (Unaxis VLR)	Ashers (Technics PEII)	Plasma Clean (Gasonics 2000)	UV Ozone Reactor	Plasma Activation (EVG 810)	XeF2 Etch (Xetch)
Al						R1	R1
Ti						R1	A
Cr				A		R1	A
Ge
Ag
Ru
Mo
Ta
W
Al₂O₃
HfO₂
ITo
SiO₂						R1	R1
SiN							R1
SiOxNy
Ta₂O₅
TiO₂
TiN
ZnO₂
ZrO₂
GaAs							R1	R1
AlGaAs				R1		R1		R1
InGaAlAs
InGaAsP
InP		R1						R1
GaN				R1		R1		R1
AlGaN
AlN
GaN
AlGaN
AlN
GaSb
CdZnTe		R1
ZnSe
Si					R1								R1
SiC
Sapphire
Material	RIE 1 (Custom)	RIE 2 (MRC)	RIE 3 (MRC)	RIE 5 (PlasmaTherm)	Si Deep RIE (PlasmaTherm/Bosch Etch)	ICP Etch 1 (Panasonic E626I)	ICP Etch 2 (Panasonic E640)	ICP-Etch (Unaxis VLR)	Ashers (Technics PEII)	Plasma Clean (Gasonics 2000)	UV Ozone Reactor	Plasma Activation (EVG 810)	XeF2 Etch (Xetch)

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