Sputtering Recipes: Difference between revisions

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| InP|| HCl:H3PO4(1:3)|| ~1000 || Highly || InGaAsP || High || [http://tel.archives-ouvertes.fr/docs/00/76/94/02/PDF/VA2_LAMPONI_MARCO_15032012.pdf Lamponi (p.102)] || Example || Jon Doe || Example
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| InP|| H3PO4:HCl(3:1)|| ~1000 || Highly || InGaAs || High || [http://tel.archives-ouvertes.fr/docs/00/76/94/02/PDF/VA2_LAMPONI_MARCO_15032012.pdf Lamponi (p.102)] || Example || Jon Doe || Example
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| InP|| H3PO4:HCl(3:1)|| ~1000 || Highly || InGaAsP || High || [http://tel.archives-ouvertes.fr/docs/00/76/94/02/PDF/VA2_LAMPONI_MARCO_15032012.pdf Lamponi (p.102)] || Example || Jon Doe || Example
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Revision as of 20:35, 17 March 2014

Back to Vacuum Deposition Recipes.

Sputter 1 (Custom)

Sputter 2 (SFI Endeavor)

Al Deposition (Sputter 2)

AlNx Deposition (Sputter 2)

Au Deposition (Sputter 2)

TiO2 Deposition (Sputter 2)

Sputter 3 (AJA ATC 2000-F)

Sputter 3 Process Table

Material P(mT) Pow(W) Sub(W) T(C) Ar N2 O2 Height-Tilt Rate(nm/min) Stress(MPa) Rs(uOhm-cm) n@633nm k@633nm Data Below
XXX XXX XXX XXX XXX XXX XXX XXX XXX XXX XXX XXX XXX XXX XXX


Ni and Ta Deposition (Sputter 3)

Sputter 4 (AJA ATC 2200-V)

W Deposition (Sputter 4)

Sputter 5 (Lesker AXXIS)

Ion Beam Deposition (Veeco NEXUS)

IBD Calibrations Spreadsheet - Records of historical film depositions (rates, indices), Uniformity etc.

All users are required to enter their calibration deps (simple test deps only)


SiO2 deposition (IBD)

  • Refractive Index: ≈1.485
  • Rate: ≈6.1nm/min (users must calibrate this prior to critical deps)
  • Stress ≈ -320MPa (compressive)

Si3N4 deposition (IBD)

  • Refractive Index ≈ 2.01
  • Rate ≈ 4.5nm/min (users must calibrate this prior to critical deps)
  • Stress ≈ -1756MPa (compressive)

Ta2O5 deposition (IBD)

  • Refractive Index ≈ 2.10
  • Rate ≈7.8nm/min (users must calibrate this prior to critical deps)
  • Stress ≈ -140MPa (compressive)

TiO2 deposition (IBD)

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