E-Beam 4 (CHA)
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About
This electron-beam evaporation system is a bell-jar type system and has the capability to do up to 9-4” wafers in a lift-off configuration and up to 18-4” wafers in a sidewall coverage configuration. Rotational motion in combination with baffling is used for lift-off and provides roughly 5% uniformity across a 4” wafer. The system has an 8-pocket e-beam source and an Inficon IC/5 deposition controller that allows for programming of fully automated multiple layer depositions.
The sidewall coverage fixturing uses full planetary motion to provide coverage over all sidewalls.
The metals available for deposition are Al, Ti, Au, Pt, Ni, Pd, Ag, Ge, Fe, NiCr, NiFe and Cr.
This system is used for n-type ohmic contact metalization to compound semiconductors, Schottky contacts to semiconductors, bond pads, and other general metalizations. The maximum deposition thickness during a run is limited to 1.0 microns.
Detailed Specifications
- Temescal 10kV power supply
- 1-Temescal 8-pocket series, 260 e-beam sources
- Cryo-pumped system with ~ 5e-7 ultimate base pressure
- Rotation with baffle for 5% uniformity over 4” wafer
- Automatic vacuum sequencing
- Temescal e-beam sweep control
- Inficon IC/5 programmable crystal thickness monitoring system
- Automatic deposition of multiple layer stacks
- Sample size:
- Pieces or
- 9x 4” wafers for lift-off (normal incidence)
- 24x 4” wafers for sidewall coverage (planetary)
- 4x 6-inch wafers for normal incidence
- Metals: Al, Ti, Au, Pt, Ni, Pd, Ag, Ge, Fe, NiCr, NiFe, Cr
Documentation
Recipes
Materials Table
For tables listing all available materials and deposition parameters, please visit the E-Beam Recipe Page.
Process Control Data
- E-Beam 4 Ti: Titanium Datasheet & Titanium Plots
- E-Beam 4 Au: Gold Datasheet & Gold Plots
- E-Beam 4 Cr: Chromium Datasheet & Chromium Plots
- E-Beam 4 Ni: Nickel Datasheet & Nickel Plots