Vacuum Deposition Recipes

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Process Control Data

See linked page for process control data (calibration data over time, such as dep. rate, refractive index, stress etc.) over time, for a selection of highly used tools/films.

Deposition Tools/Materials Table

The Key/Legend for this table's A...R6 values is at the bottom of the page.

Vacuum Deposition Recipes

E-Beam Evaporation Sputtering Thermal Evaporation Plasma Enhanced Chemical
Vapor Deposition (PECVD)
Atomic Layer Deposition Molecular Vapor Deposition
Material E-Beam 1 (Sharon) E-Beam 2 (Custom) E-Beam 3 (Temescal) E-Beam 4 (CHA) Sputter 3
(AJA ATC 2000-F)
Sputter 4
(AJA ATC 2200-V)
Sputter 5 (AJA ATC 2200-V) Ion Beam
Deposition (Veeco Nexus)
Thermal
Evap 1
Thermal Evap 2 (Solder) PECVD 1
(PlasmaTherm 790)
PECVD 2
(Advanced Vacuum)
Unaxis VLR ICP-PECVD Atomic Layer Deposition (Oxford FlexAL) Molecular Vapor Deposition (Tool)
Ag R2
R2 R2 A A








Al R2
R2 R2 A R1
R1 A A




Al2O3 R2

A R1
R5




R4
AuGe R1
AlN



A A
R1




R4
Au R2
R2 R2 A R1

A A




B














C R3
CeO2
R3












Co R2

R2 R









Cr R1

R2 R


A A




Cu R1


R1 A








Fe R2

R2 R









Ge R2
R2 R2 A A








GeO2 R2
Gd R2

R1










Hf R1


R1











HfO2



A A






R4
In








A




Ir R1

R1










ITO
R3

A A
R1






MgF2 A A
MgO R2
Mo R2


R A








Nb R2



R








Nd



A








Ni R2
R2 R2 R1


A A




NiCr R2 R2
NiFe R1 R2 A
Pd R2
R2 R2



A A




Pt R2
R2 R2 A R1 R1





R4
Ru R2

R2
R






R4
Si
R2

R A
R1


R3

SiN



R1 A
R6

R6 R6 R6

SiN - Low Stress R4 R6 R6
SiO2 R2 R2

R1 A A R6

R6 R6 R6 R4
SiOx R1
SiOxNy






R3

R4



Sn








A




SrF2
R2












Ta R1


R1 A
R1






Ta2O5
R1
R1


R6






Ti R2
R2 R2 R1 R1 R1 R1






TiN




R
R1




R4
TiW R1


A R1








TiO2
R2

A R1
R5




R4
V



A A








W R2


A R1








Zn







A A




ZnO












R3
Zr R2

R2 A A








ZrO2












R4
Material E-Beam 1 (Sharon) E-Beam 2 (Custom) E-Beam 3 (Temescal) E-Beam 4 (CHA) Sputter 3
(ATC 2000-F)
Sputter 4
(ATC 2200-V)
Sputter 5 (ATC 2200-V) Ion Beam
Deposition (Veeco Nexus)
Thermal
Evap 1
Thermal Evap 2 (Solder) PECVD 1
(PlasmaTherm 790)
PECVD 2
(Advanced Vacuum)
Unaxis VLR ICP-PECVD Atomic Layer Deposition (Oxford FlexAl) Molecular Vapor Deposition (Tool)

Process Ranking Table

Processes in the table above are ranked by their "Process Maturity Level" as follows:

Process Level Description of Process Level Ranking
A Process Allowed and materials available but never done
R1 Process has been ran at least once
R2 Process has been ran and/or procedure is documented or/and data available
R3 Process has been ran, procedure is documented, and data is available
R4 Process has a documented procedure with regular (≥4x per year) data or lookahead/in-Situ control available
R5 Process has a documented procedure with regular (≥4x per year) data and lookahead/in-Situ control available
R6 Process has a documented procedure, regular ( ≥4x per year) data, and control charts/limits available