Vacuum Deposition Recipes

Process Control Data

See linked page for process control data (calibration data over time, such as dep. rate, refractive index, stress etc.) over time, for a selection of highly used tools/films.

Deposition Tools/Materials Table

The Key/Legend for this table's A...R6 values is at the bottom of the page.

Vacuum Deposition Recipes
	E-Beam Evaporation				Sputtering				Thermal Evaporation		Plasma Enhanced Chemical Vapor Deposition (PECVD)			Atomic Layer Deposition	Molecular Vapor Deposition
Material	E-Beam 1 (Sharon)	E-Beam 2 (Custom)	E-Beam 3 (Temescal)	E-Beam 4 (CHA)	Sputter 3 (AJA ATC 2000-F)	Sputter 4 (AJA ATC 2200-V)	Sputter 5 (AJA ATC 2200-V)	Ion Beam Deposition (Veeco Nexus)	Thermal Evap 1	Thermal Evap 2 (Solder)	PECVD 1 (PlasmaTherm 790)	PECVD 2 (Advanced Vacuum)	Unaxis VLR ICP-PECVD	Atomic Layer Deposition (Oxford FlexAL)	Molecular Vapor Deposition (Tool)
Ag	R2		R2	R2	R1	R1			R1	R1
AgBr										R1
AgCl										R1
Al	R2		R2	R2	R1	R3	R1	R1	R3	R1
Al2O3		R2			R3	R3	R1	R5						R4
As										R1
AuPd									R1
AuZn									R1
AuGe	R1
AlN					R1	R1		R1						R4
Au	R2		R2	R2	R1	R3			R3	R2
B										R1
Be										R1
C	R3									R1
Cd										R1
CdS										R1
CdTe										R1
CaF2										R2
CeO2		R3
Co	R2			R2	R3				R1	R1
Cr	R1			R2	R3		R3		R3	R2
Cu	R1				R3	R2			R2	R1
Fe	R2			R2	R3				R1	R1
Ga										R1
GaAs										R1
Ge	R2		R2	R2	R1	R1				R1
GeO2		R2
Gd	R2			R1
Hf	R1			R1
HfO2					R1	R1								R4
Hg										R1
In										R3
InSb										R1
Ir	R1			R1					R1	R1
ITO		R3			R1	R1		R1
KCl										R1
LiF										R1
Mg									R1	R1
MgF2					R1	R1				R1
MgO		R2								R1
Mn									R2	R1
MnS										R1
Mo	R2				R3	R1				R1
Na										R1
NaCl										R1
Nb	R2					R3				R1
NbO5										R1
Nd						R1
Ni	R2		R2	R2	R3				R3	R2
NiCr	R2			R2					R3
NiFe	R1			R2	R1				R3
Pb										R1
PbS										R1
Pd	R2		R2	R2					R3	R1
Pt	R2		R2	R2	R3	R3	R3			R1				R4
Ru	R2			R2		R3								R4
Sb										R1
Se										R1
Si		R2			R3	R1		R1		R1		R3
SiN					R3	R1		R6			R6	R6	R6
SiN - Low Stress											R4	R6	R6
SiO2	R2	R2			R3	R1	R2	R6		R1	R6	R6	R6	R4
SiOx		R1
SiO									R1	R1
SiOxNy								R3			R4
Sn										R2
SrF2		R2							R1
Ta	R1				R3	R1		R1		R1
Ta2O5		R1		R1				R6		R1
Ti	R2		R2	R2	R3	R3	R3	R1		R2
TiN						R3		R1						R4
TiW	R1				R2	R3
TiO										R1
TiO2		R2			R1	R3		R5		R1				R4
V					R1	R1
W	R2				R2	R3				R1
WC										R1
Zn									R3	R2
ZnO									R1	R1				R3
ZnS										R1
Zr	R2			R2	R1	R1				R1
ZrO2										R1				R4
Material	E-Beam 1 (Sharon)	E-Beam 2 (Custom)	E-Beam 3 (Temescal)	E-Beam 4 (CHA)	Sputter 3 (ATC 2000-F)	Sputter 4 (ATC 2200-V)	Sputter 5 (ATC 2200-V)	Ion Beam Deposition (Veeco Nexus)	Thermal Evap 1	Thermal Evap 2 (Solder)	PECVD 1 (PlasmaTherm 790)	PECVD 2 (Advanced Vacuum)	Unaxis VLR ICP-PECVD	Atomic Layer Deposition (Oxford FlexAl)	Molecular Vapor Deposition (Tool)

Process Ranking Table

Processes in the table above are ranked by their "Process Maturity Level" as follows:

Process Level	Description of Process Level Ranking
A	Process Allowed and materials available but never done
R1	Process has been ran at least once
R2	Process has been ran and/or procedure is documented or/and data available
R3	Process has been ran, procedure is documented, and data is available
R4	Process has a documented procedure with regular (≥4x per year) data or lookahead/in-Situ control available
R5	Process has a documented procedure with regular (≥4x per year) data and lookahead/in-Situ control available
R6	Process has a documented procedure, regular ( ≥4x per year) data, and control charts/limits available