Automated Wafer Cleaver (Loomis LSD-155LT)

Automated Wafer Cleaver (Loomis LSD-155LT) Location Backend Lab: ESB 1111 Tool Type Packaging Manufacturer Loomis Industries Inc. Model LSD-155LT Description Loomis Automated Wafer Cleaver Primary Supervisor Aidan Hopkins (805) 893-2343 hopkins@ece.ucsb.edu Materials III-V's, thin Silicon Recipes

About

The Loomis LSD-155Lt is a production scribe and break system that can be used for processing large grids, arrays of laser bars, cleaving high quality mirror facets, and dicing wafers.

Detailed Specifications

• Maximum Wafer Size: 4"
• Parts mounted to low tack tape and used in conjunction with 6" plastic rings.
• Automated cut maps at multiple angles (0° and 90° typical)
• ~few micron alignment to on-wafer features.
• Multiple scribe and cleave options including 'scribe and break', 'notch and cleave', and 'peck and cleave'.
• Users should try and follow the 3 to 1 ratio (distance between cleaves should be 3X the thickness of the substrate) although some material like InP and GaAs can occasionally be cleaved closer to 2 to 1.
  • Thinning the substrate allows for much easier cleaving and cleave lines closer together.

Operating Procedures

• Loomis LSD-155LT Standard Operating Procedure

Recipes

• Recipes > Packaging > Wafer Cleaver Recipes (LSD-155LT)
• Wafer thinning is critical, see the Wafer Lapping (Allied 10-1110) tool as well.