E-Beam Lithography System (Raith EBPG 5150+)
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About
TBD
Detailed Specifications
- Maximum write area:
- Maximum wafer/substrate size:
- Cassette loader/substrate holders available
- Beam Voltage: 100kV
- Min/Maximum Current (Dose):
- Scanner Speed (or other speed specs):
- Layer-to-Layer Alignment Accuracy:
- Options purchased:
- Non-Manhattan scanning for curved edges
- Stand-alone optical alignment station
- OTHER
(Other EBL-specific specs)
- Advanced Fracturing software available (Layout BEAMER from GeniSys, Inc)
- automated proximity correction of patterns possible
- ability to manually position write fields within a pattern for optimum inter-field writing performance
- ability to adjust beam scanning strategy within a write field for optimum intra-field writing performance
- fine tuning of line-edge roughness by shot pitch correction
Recipes
All recipes can be found on the following page:
- Recipes > Litho. > Direct-Write > EBL Recipes.