E-Beam Lithography System (Raith EBPG 5150+)
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About
Raith EBPG5150 Plus - Ultra High-Performance e-Beam Writer
The Raith EBPG Electron-Beam Lithography (EBL) tool is a high-speed, high current lithography tool for achieving lower than 10nm features, but also capable of very fast writing with the 350nA max current and higher speed 125MHz pattern generator & increased write-field size. The tool has fully automated/programmable aperture switching and beam calibrations. This enables the Raith EBL to write full-wafers at high speed for larger features (high current) and automatically switch+calibrate to exposure small (<<50nm) features in a single exposure, with sophisticated mix+match capabilities and pattern generation for maximum throughput while achieving the best high-resolution performance.
Detailed Specifications
- Minimum feature size: 8nm
- 0.6nm stage movement resolution
- Layer-to-Layer Alignment/Overlay Accuracy: ≤5nm
- Maximum wafer/substrate size:
- Diameter: 150mm wafer (155mm x 155mm stage traverse)
- Thickness: 3mm
- (smaller piece-parts are common)
- 10-holder load-lock
- 2x Cassette loader/substrate holders available,
- Programmable/automated loading/switchout available via software.
- Beam Voltage: 50kV + 100kV
- Beam Current: 50pA – 350nA
- Automatic aperture changer
- Scanner Speed: 125MHz
- Exposure Field Size: 1.048 mm field size, continuously variable down to < 0.1 mm
- Single-nanometer stepping within the field
- Available at all beam currents and voltages
- Stand-alone optical alignment station (for pre-alignment of wafer to holder)
- Other capabilities:
- Automatic, dynamic off-axis focus, stigmation and field distortion corrections
- Integrated Laser height sensor for field-by-field or pre-mapping mode with direct electron feedback to deflection and focus corrections.
- Advanced write software available: Layout BEAMER from GeniSys Inc.
- Automated proximity correction of patterns possible
- Ability to manually position write fields within a pattern for optimum inter-field writing performance
- Ability to adjust beam scanning strategy within a write field for optimum intra-field writing performance
- Fine tuning of line-edge roughness by shot pitch correction & non-Manhattan scanning for curved edges
Operating Procedures
Training Procedure
- Contact Bill Mitchell for training, via SUM:
| Request Training |
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Recipes
All recipes can be found on the following page:
- Recipes > Litho. > Direct-Write > EBL Recipes.
We have a number of litho processes "matching" between the ASML DUV Stepper and this tool.