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- ...lar [https://en.wikipedia.org/wiki/Statistical_process_control Statistical Process Control (SPC)]. ...same links are found on individual tool pages, in the '''''<<tool page>> > Process Control''''' section.13 KB (1,987 words) - 18:04, 7 November 2024
- .../wiki.nanotech.ucsb.edu/w/index.php?title=Staff_List#Process_Group NanoFab Process Group].'' ==Process Control Calibration Procedures==2 KB (297 words) - 23:46, 11 September 2023
- The process group hosts a number of interns each year! Find out more on our [https://na2 KB (287 words) - 21:14, 6 November 2024
- ...5214 negative process schematic.png|alt=2D schematic of AZ5214 negative PR process|none|thumb|594x594px|Negative operation - requiring PEB and Flood Expose]] === Basic Process Flow ===999 bytes (161 words) - 23:39, 22 August 2024
- ...Process Control Data]] so NanoFab staff can proactively identify equipment/process problems, and # '''Industry-Relevant Experience''': Give [[Process Group Interns|Interns]] hands-on industry-relevant experience to minimize t5 KB (717 words) - 21:12, 6 November 2024
- The wafers for process calibration are ordered from a wafer supplier that sells high grade, qualit === Scan before process calibration ===2 KB (339 words) - 18:31, 22 April 2020
- 4 KB (596 words) - 04:43, 23 November 2021
- ...u could leave and come back when all runs are finished. You should monitor process at the very beginning to make sure there are no any issues with the run. ...u could leave and come back when all runs are finished. You should monitor process at the very beginning to make sure there are no any issues with the run.4 KB (711 words) - 20:32, 30 March 2020
- 3 KB (416 words) - 23:54, 22 April 2020
- ...SiO2 deposition at 250C in PECVD#1. Instructions bellow explain how to run process (seasoning, deposition, cleaning).2 KB (270 words) - 20:16, 10 December 2020
- The wafers for process calibration are ordered from a wafer supplier that sells high grade, qualit ...re ''before'' the process step, and subtract that value from the ''after'' process value. If your ''before'' measurement shows high (eg. >200 particles), do33 KB (5,424 words) - 00:05, 5 January 2024
- Use vapor coating in a clean-dry environment process as follows:775 bytes (111 words) - 20:38, 26 July 2020
- **[https://trello.com/b/pUtJ3nlC/process-fab-jobs?filter=member:demisdjohn Demis' Fab Services] **[https://trello.com/b/pUtJ3nlC/process-fab-jobs?filter=member:biljanastamenic Biljana's Fab Services]1 KB (173 words) - 23:52, 6 December 2022
- 21 bytes (3 words) - 23:00, 30 March 2020
- 2 KB (325 words) - 23:38, 30 March 2020
- 3 KB (440 words) - 18:08, 30 January 2021
- ==Process Control Data - InP Ridge Etch (Oxford ICP Etcher)==8 KB (1,214 words) - 22:38, 12 January 2023
- 5 KB (717 words) - 01:41, 22 November 2022
- The wafers for process calibration are ordered from SVM (<nowiki>https://www.svmi.com/</nowiki>). === Wafer Coating Process traveler ===3 KB (515 words) - 20:41, 20 April 2020
Page text matches
- ...5214 negative process schematic.png|alt=2D schematic of AZ5214 negative PR process|none|thumb|594x594px|Negative operation - requiring PEB and Flood Expose]] === Basic Process Flow ===999 bytes (161 words) - 23:39, 22 August 2024
- |position = Process Engineer ...ring. This experience inspired him to accept a position as a Semiconductor Process Engineer at Lockheed Martin/Santa Barbara Focalplane in Goleta, where he co1 KB (213 words) - 11:47, 16 September 2024
- (This process can easily be transferred to I-Line photoresists, using the [[Contact Align ===Photo-EBR Process===1 KB (207 words) - 06:06, 5 October 2022
- .../wiki.nanotech.ucsb.edu/w/index.php?title=Staff_List#Process_Group NanoFab Process Group].'' ==Process Control Calibration Procedures==2 KB (297 words) - 23:46, 11 September 2023
- ==Process Group== *[[Process Group - Remote Fabrication Jobs|'''Job Tracking''']] - pages to organize an2 KB (338 words) - 23:10, 9 April 2024
- ==HMDS Process for PR Improving Adhesion== This process tends to improve adhesion between the substrate and subsequent photoresist1 KB (198 words) - 19:41, 10 February 2024
- *[[:Category:Wet Processing|Wet Process]] *[[:Category:Thermal Processing|Thermal Process]]3 KB (370 words) - 20:59, 2 November 2023
- *[[:Category:Wet Processing|Wet Process]] *[[:Category:Thermal Processing|Thermal Process]]3 KB (370 words) - 23:04, 13 October 2024
- The wafers for process calibration are ordered from a wafer supplier that sells high grade, qualit === Scan before process calibration ===2 KB (339 words) - 18:31, 22 April 2020
- *A position in the "[[Staff List#Process Group|Process Group]]", led by [[Demis D. John]]. ...p - Process Control Data#Deposition .28Process Control Data.29|Deposition: Process Control data]].4 KB (628 words) - 00:44, 3 October 2024
- ...r films in PECVD#1, Advanced PECVD#2, and Unaxis) to establish statistical process control. Biljana is holding trainings on tools: GCA 6300 Stepper#1, Autoste1 KB (191 words) - 23:07, 29 December 2023
- ...clean surfaces can be achieved in less than one minute. In addition, this process does not damage any sensitive device structures of MOS gate oxide. The syst961 bytes (145 words) - 16:17, 29 August 2023
- ==Process Group== ...es, recipe development, and some direct tool training and maintenance. The Process Group helps to ensure that equipment is providing the expected processing c5 KB (764 words) - 23:38, 14 August 2024
- The wafers for process calibration are ordered from SVM (<nowiki>https://www.svmi.com/</nowiki>). === Wafer Coating Process traveler ===3 KB (515 words) - 20:41, 20 April 2020
- ...is often unique in geometry and material combinations so that independent process development is required for most CMP applications.1 KB (148 words) - 18:03, 30 August 2022
- Each process tube can accomodate up to one hundred 8” wafers per cycle. We have boats ==Process Information==4 KB (502 words) - 22:00, 24 October 2024
- == Running a process on RIE #5 == # Choose the '''Process Menu''' located on bottom left corner of the screen. It's the one with the2 KB (377 words) - 21:09, 17 October 2018
- ...lar [https://en.wikipedia.org/wiki/Statistical_process_control Statistical Process Control (SPC)]. ...same links are found on individual tool pages, in the '''''<<tool page>> > Process Control''''' section.13 KB (1,987 words) - 18:04, 7 November 2024
- == [[ICP Etching Recipes#Process Control Data .28Panasonic 2.29|Process Control Data]] == ...1m0l_UK2lDxlgww4f6nfXe4aQedNeDZsLs46jQ5wR4zw/edit#gid=1804752281 Click for Process Control Charts]|link=https://docs.google.com/spreadsheets/d/1m0l_UK2lDxlgww3 KB (511 words) - 21:22, 6 November 2024
- ==Single-step Si Etching (not Bosch Process!) (Si Deep RIE)==1 KB (199 words) - 23:04, 6 August 2024