Difference between revisions of "Surface Analysis (KLA/Tencor Surfscan)"
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==Documentation== |
==Documentation== |
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*[[KLA-Tencor Surfscan - Standard Operating Procedure|Standard Operating Procedure]] |
*[[KLA-Tencor Surfscan - Standard Operating Procedure|Standard Operating Procedure]] |
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*[https://wiki.nanotech.ucsb.edu/w/images/9/96/Surfscan-Operation-Manual.pdf Operations Manual] |
*[https://wiki.nanotech.ucsb.edu/w/images/9/96/Surfscan-Operation-Manual.pdf Operations Manual] |
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*[[Glossary]] |
*[[Glossary]] |
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*[[Errors]] |
*[[Errors]] |
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+ | <br /> |
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+ | == Examples == |
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+ | <br /> |
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+ | {| class="wikitable" |
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+ | |+A low-particle 4-inch wafer example: |
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+ | !Gain 4: Small Particles |
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+ | (0.160µm – 1.60µm) |
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+ | !Gain 2: Large Particles |
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+ | (1.60µm – 28.0µm) |
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+ | |- |
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+ | |[[File:Surfscan Low-Particle Example - G4.png|frameless|200x200px]] |
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+ | |[[File:Surfscan Low-Particle Example - G2.png|frameless|200x200px]] |
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+ | |} |
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+ | {| class="wikitable" |
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+ | |+A high-particle 4-inch wafer example: |
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+ | !Gain 4: Small Particles |
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+ | (0.160µm – 1.60µm) |
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+ | !Gain 2: Large Particles |
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+ | (1.60µm – 28.0µm) |
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+ | |- |
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+ | |''To Be Added'' |
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+ | |''To Be Added'' |
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+ | |} |
Revision as of 15:09, 18 November 2021
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About
This system uses a laser-based scattering method to count size and distribution of particles (or other scattering defects) on a flat wafer surface. It can scan wafers in size from 4 to 8 inches.
Documentation
- Standard Operating Procedure
- Operations Manual
- For detailed measurement info, it is highly recommended that you read the manual.
- Wafer scanning process traveler
- Glossary
- Errors
Examples
Gain 4: Small Particles
(0.160µm – 1.60µm) |
Gain 2: Large Particles
(1.60µm – 28.0µm) |
---|---|
Gain 4: Small Particles
(0.160µm – 1.60µm) |
Gain 2: Large Particles
(1.60µm – 28.0µm) |
---|---|
To Be Added | To Be Added |