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  • * Job to copy: '''TEST''' * From? '''[10,61]TEST.*'''
    2 KB (395 words) - 22:24, 13 June 2019
  • #Job to copy: '''TEST''' #From? '''[10,61]TEST.*'''
    2 KB (412 words) - 20:08, 7 April 2020
  • # Job to copy: '''TEST''' # From? '''[10,61]TEST.*'''
    3 KB (440 words) - 17:01, 5 May 2021
  • ==== Test run on "dummy wafer" ==== ** Load cleaning recipe "Post dep PD", t=900sec
    3 KB (515 words) - 20:41, 20 April 2020
  • ***Chamber season on a clean test wafer *Seasoning recipe name: '''SiO2 seasoning''', '''t=2min'''
    5 KB (862 words) - 19:06, 13 August 2024
  • ::::'''''SiO 1/4λ time''': t<sub>1/4λ</sub> = 259.4nm ÷ 5.2nm/min = 49.88min = '''2993.077 sec''''' ...sub>1/4λ</sub> * λ<sub>target</sub> / λ<sub>measured</sub> = ''corrected'' t<sub>1/4λ</sub>
    5 KB (758 words) - 17:19, 9 March 2024
  • ...ent markers for various NanoFab lithography systems, along with resolution test structures and patterns for calibrating [https://en.wikipedia.org/wiki/Opti ===Resolution Test Charts===
    10 KB (1,194 words) - 16:35, 1 May 2024
  • |type = Inspection, Test and Characterization ...probes are provided. The measurements can be taken with various electronic test equipment detailed below, including HP multimeters, a Tektronix Curve-Trace
    4 KB (511 words) - 20:23, 10 February 2023
  • **Battery Test<br /> ''Old pages we don't use on the Wiki anymore, but are kept for possible utility later on.''
    2 KB (338 words) - 23:10, 9 April 2024
  • |type = Inspection, Test and Characterization ...considered a "reasonable" fit because the curves are very similar, but don't overlay perfectly, giving only reasonable confidence in the reported number
    4 KB (645 words) - 21:28, 29 September 2022
  • |type = Inspection, Test and Characterization ...aves literally hundreds of hours over non-infrared techniques and it doesn't damage or affect the part in any way.
    3 KB (376 words) - 16:37, 30 August 2022
  • UPDATE: doesn’t work: Ning tried this and found these patterns were too difficult to see on *** ''More info on either pattern can be [[ASML Stepper 3 - UCSB Test Reticles|found here]].''
    3 KB (430 words) - 18:07, 30 January 2021
  • ...lines must be manually switched between the two options shown (gasses can't be used simultaneously): N<sub>2</sub>/He, CHF<sub>3</sub>/Ar and CF<sub>4< **''Historical Data'' records "calibration" etches to test tool performance.
    4 KB (697 words) - 22:18, 7 February 2024
  • ...ern "Visual Editor". Due to existing page linking/URLs, many of these can't be changed (such as code used for superscripts and subscripts in page names Only Staff & Admins can make new pages. If you want to do this but don’t have permission, please let the [[Wiki Admin|wiki admin]] know and we’ll
    18 KB (3,183 words) - 19:52, 4 September 2021
  • ...ice users. Charge for All wafers, including test/dummy wafers that we don't send to the user. Discuss any possible exceptions as needed.
    4 KB (596 words) - 04:43, 23 November 2021
  • ...aled to the 5x/4x reticle scale), so they will print & measure & guarantee test structures at that exact size. *You don't have to include the Stepper outer template - usually photomask vendors can
    8 KB (1,216 words) - 18:32, 27 September 2024
  • **For ''Back side alignment'', don't forget to mirror your pattern horizontally/over the Y-axis (since your wafe ...aled to the 5x/4x reticle scale), so they will print & measure & guarantee test structures at that exact size.
    7 KB (1,188 words) - 03:23, 23 October 2024
  • ...ne-types (Curves and Line/polyline/LWLine for example) used in AutoCAD don't convert as expected into the polygons needed for printing. Also the DXF fi *[[Resolution Test structures]] - '''''To Be Added'''''
    17 KB (2,487 words) - 05:15, 3 October 2024
  • ...he die center at the wafer plane is entered for X and Y. You should run a test sample to determine how well the DFAS system is performing for your mask se Don’t forget to save the changes. If you just wanted to look at the program you
    35 KB (6,172 words) - 15:49, 23 March 2020