Vacuum Deposition Recipes

Process Control Data

See linked page for process control data (calibration data over time, such as dep. rate, refractive index, stress etc.) over time, for a selection of highly used tools/films.

Deposition Tools/Materials Table

The Key/Legend for this table's A...R6 values is at the bottom of the page.

Vacuum Deposition Recipes
	E-Beam Evaporation				Sputtering				Thermal Evaporation		Plasma Enhanced Chemical Vapor Deposition (PECVD)			Atomic Layer Deposition	Molecular Vapor Deposition
Material	E-Beam 1 (Sharon)	E-Beam 2 (Custom)	E-Beam 3 (Temescal)	E-Beam 4 (CHA)	Sputter 3 (AJA ATC 2000-F)	Sputter 4 (AJA ATC 2200-V)	Sputter 5 (AJA ATC 2200-V)	Ion Beam Deposition (Veeco Nexus)	Thermal Evap 1	Thermal Evap 2 (Solder)	PECVD 1 (PlasmaTherm 790)	PECVD 2 (Advanced Vacuum)	Unaxis VLR ICP-PECVD	Atomic Layer Deposition (Oxford FlexAL)	Molecular Vapor Deposition (Tool)
Ag	A		A	A	A	A
Al	A		A	A	A	R1		R1	A	A
Al2O3	A	A			A	R1		R5						R4
AlN					A	A		R1						R4
Au	A		A	A	A	R1			A	A
B
C	R1
CeO2		CeO2 deposition (E-Beam 2)
Co	A			A	R
Cr	A			A	R				A	A
Cu	A				R1	A
Fe	A			A	R
Ge	A		A	A	A	A
GeO2		A
Gd	A			A
Hf	A
HfO2					A	A								R4
In										A
Ir	A
ITO		ITO deposition (E-Beam 2)			A	A		R1
MgF2					A	A
MgO		A
Mo	A				R	A
Nb	A					R
Nd						A
Ni	A		A	A	R1				A	A
NiCr	A			A
NiFe	A			A	A
Pd	A		A	A					A	A
Pt	A		A	A	A	R1	R1							R4
Ru	A			A		R								R4
Si		A			R	A		R1				R3
SiN					R1	A		R6			R6	R6	R6
SiN - Low Stress											R4	R6	R6
SiO2	A	A			R1	A	A	R6			R6	R6	R6	R4
SiOxNy								R3			R4
Sn										A
SrF2		A
Ta	A				R1	A		R1
Ta2O5				A				R6
Ti	A		A	A	R1	R1	R1	R1
TiN						R		R1						R4
TiW	A				A	R1
TiO2		A			A	R1		R5						R4
V					A	A
W	A				A	R1
Zn									A	A
ZnO														R3
Zr	A			A	A	A
ZrO2														R4
Material	E-Beam 1 (Sharon)	E-Beam 2 (Custom)	E-Beam 3 (Temescal)	E-Beam 4 (CHA)	Sputter 3 (ATC 2000-F)	Sputter 4 (ATC 2200-V)	Sputter 5 (ATC 2200-V)	Ion Beam Deposition (Veeco Nexus)	Thermal Evap 1	Thermal Evap 2 (Solder)	PECVD 1 (PlasmaTherm 790)	PECVD 2 (Advanced Vacuum)	Unaxis VLR ICP-PECVD	Atomic Layer Deposition (Oxford FlexAl)	Molecular Vapor Deposition (Tool)

Process Ranking Table

Processes in the table above are ranked by their "Process Maturity Level" as follows:

Process Level	Description of Process Level Ranking
A	Process Allowed and materials available but never done
R1	Process has been ran at least once
R2	Process has been ran and/or procedure is documented or/and data available
R3	Process has been ran, procedure is documented, and data is available
R4	Process has a documented procedure with regular (≥4x per year) data or lookahead/in-Situ control available
R5	Process has a documented procedure with regular (≥4x per year) data and lookahead/in-Situ control available
R6	Process has a documented procedure, regular ( ≥4x per year) data, and control charts/limits available