SEM 1 (JEOL IT800SHL)

SEM 1 (JEOL IT800SHL) Location Bay 1 Tool Type Inspection, Test and Characterization Manufacturer JEOL USA Inc Description JEOL 7600F FESEM Primary Supervisor Aidan Hopkins (805) 893-2343 hopkins@ece.ucsb.edu Secondary Supervisor Bill Mitchell Recipes

About

The JEOL IT800HSL Field Emission Scanning Electron Microscope is used for imaging a variety of samples made in the facility.

Capabilities

The system has multiple detectors, detailed below. Low-vacuum mode reduces sample charging by introducing N2 gas into the chamber, without sacrificing imaging quality (using a special vacuum nozzle on the electron column). Both of these are useful for imaging low conductivity and insulating materials without the need for conductive layer coatings.

The system can accept a 6” wafer, but only 140mm (X) and 80mm (Y) of the wafer is accessible with the stage movement.

The Hummer coater is used to deposit a thin AuPd on your samples, to reduce electrical charging of insulating samples (such as SiO2 substrates, or thick >1µm layers of SiO2 or PR).

This SEM also has an Electron-Beam Lithography Nabity system. Contact Aidan Hopkins for info.

Detailed Specifications

Imaging

• Resolution:
  • 0.5nm at 15kV SHL mode
  • 0.7nm at 1kV
  • 0.9nm at 500V
• Magnification:
  • Photo magnification: x10 to x2,000,000 (128mm x 96mm)
  • Display magnification: x27 to x5,480,000 (1280pix x 960pix)
• Imaging Modes:
  • STD: Standard
  • LDF: Large depth of focus
  • BD: Beam deceleration
    • Applies negative voltage to sample stage to increase effective acceleration without increasing beam acceleration (reducing charging).
  • SHL: Super hybrid lens
• Detectors
  • SED: Secondary electron detector (low angle)
  • UHD: Ultra high resolution detector
  • SBED: Scintillated back scatter electron detector
    • Inserts between the objective lens and the sample
  • LVBED: Low vacuum back scatter electron detector
  • LVSED: Low vacuum secondary electron detector
• Accelerating Voltages:
  • SEM: 0.01 to 30kV
• Probe currents
  • A few pA to 500nA (30kV) 100nA (5kV)
• Specimen stage
  • X: 140mm Y: 80mm
  • Z: 6mm to 41mm
  • Tilt: -5 to 70 degrees (depending on sample holder and offset)
  • Rotation: 360 degrees

Mechanical

• Max Sample Size: 6-inch wafer
• Stage movement:
  • max: 70 x 50mm
  • 4-inch wafer: limited to ~25x25mm movement area from wafer center.
• Tilt: -5° to varies. Tilt is dependent on sample holder, stage height, and offset value.
• Rotation: 360°
• Specimen holders :
  • Copper and XYZ Carbon tape available
  • 4-inch wafer with topside clips
  • 1-inch holder for 30°/90°, 45°/90° mounting with tape or clips.

Operating Procedures

• JEOL IT800SHL Operating Procedure.
• Optimizing Astigmatism (CalTech Nanoscience Institute)
  • Stig is the most common cause of blurry images.
  • A Common mistake is to optimize stig on flat lines (eg. a cleaved edge or line/space features). This always leads to accidentally skewing the stig in the direction of the lines. Instead, make sure to optimize on a roundish feature, such as a piece of dust/debris.