Vacuum Deposition Recipes: Difference between revisions

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Revision as of 19:38, 13 August 2024

Process Control Data

See linked page for process control data (calibration data over time, such as dep. rate, refractive index, stress etc.) over time, for a selection of highly used tools/films.

Deposition Tools/Materials Table

The Key/Legend for this table's A...R6 values is at the bottom of the page.

Vacuum Deposition Recipes

 E-Beam Evaporation Sputtering Thermal Evaporation Plasma Enhanced Chemical
Vapor Deposition (PECVD) 		Atomic Layer Deposition Molecular Vapor Deposition
Material E-Beam 1 (Sharon) E-Beam 2 (Custom) E-Beam 3 (Temescal) E-Beam 4 (CHA) Sputter 3
(AJA ATC 2000-F) 		Sputter 4
(AJA ATC 2200-V) 		Sputter 5 (AJA ATC 2200-V) Ion Beam
Deposition (Veeco Nexus) 		Thermal
Evap 1 		Thermal Evap 2 (Solder) PECVD 1
(PlasmaTherm 790) 		PECVD 2
(Advanced Vacuum) 		Unaxis VLR ICP-PECVD Atomic Layer Deposition (Oxford FlexAL) Molecular Vapor Deposition (Tool)
Ag R2
R2 R2 R1 R1








Al R2
R2 R2 R1 R3 R1 R1 A A




Al2O3 R2

R3 R3 R1 R5




R4
AuGe R1
AlN



R1 R1
R1




R4
Au R2
R2 R2 R1 R3

A A




B














C R3
CeO2
R3












Co R2

R2 R3









Cr R1

R2 R3


A A




Cu R1


R3 R2








Fe R2

R2 R3









Ge R2
R2 R2 R1 R1








GeO2 R2
Gd R2

R1










Hf R1


R1










HfO2



R1 R1






R4
In








A




Ir R1

R1










ITO
R3

R1 R1
R1






MgF2 R1 R1
MgO R2
Mo R2


R3 R1








Nb R2



R3








Nd



R1








Ni R2
R2 R2 R3


A A




NiCr R2 R2
NiFe R1 R2 R1
Pd R2
R2 R2



A A




Pt R2
R2 R2 R3 R3 R3





R4
Ru R2

R2
R3






R4
Si
R2

R3 R1
R1


R3

SiN



R3 R1
R6

R6 R6 R6

SiN - Low Stress R4 R6 R6
SiO2 R2 R2

R3 R1 R2 R6

R6 R6 R6 R4
SiOx R1
SiOxNy






R3

R4



Sn








A




SrF2
R2












Ta R1


R3 R1
R1






Ta2O5
R1
R1


R6






Ti R2
R2 R2 R3 R3 R3 R1






TiN




R3
R1




R4
TiW R1


R2 R3








TiO2
R2

R1 R3
R5




R4
V



R1 R1








W R2


R2 R3








Zn







A A




ZnO












R3
Zr R2

R2 R1 R1








ZrO2












R4
Material E-Beam 1 (Sharon) E-Beam 2 (Custom) E-Beam 3 (Temescal) E-Beam 4 (CHA) Sputter 3
(ATC 2000-F) 		Sputter 4
(ATC 2200-V) 		Sputter 5 (ATC 2200-V) Ion Beam
Deposition (Veeco Nexus) 		Thermal
Evap 1 		Thermal Evap 2 (Solder) PECVD 1
(PlasmaTherm 790) 		PECVD 2
(Advanced Vacuum) 		Unaxis VLR ICP-PECVD Atomic Layer Deposition (Oxford FlexAl) Molecular Vapor Deposition (Tool)

Process Ranking Table

Processes in the table above are ranked by their "Process Maturity Level" as follows:

Process Level Description of Process Level Ranking
A Process Allowed and materials available but never done
R1 Process has been ran at least once
R2 Process has been ran and/or procedure is documented or/and data available
R3 Process has been ran, procedure is documented, and data is available
R4 Process has a documented procedure with regular (≥4x per year) data or lookahead/in-Situ control available
R5 Process has a documented procedure with regular (≥4x per year) data and lookahead/in-Situ control available
R6 Process has a documented procedure, regular ( ≥4x per year) data, and control charts/limits available
Retrieved from "https://wiki.nanofab.ucsb.edu/w/index.php?title=Vacuum_Deposition_Recipes&oldid=162207"