Tool List: Difference between revisions
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=Thermal Processing= |
=Thermal Processing= |
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* [[ |
* [[Rapid Thermal Processor]] |
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* [[ |
* [[Strip Annealer]] |
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* [[ |
* [[Tube Furnace (Tystar 8300)]] |
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* [[Tube Furnace Wafer Bonding (Thermco)]] |
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* [[Spin Rinse Dryer]] |
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* [[Tube Furnace AlGaAs Oxidation (Linberg)]] |
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=Packaging= |
=Packaging= |
Revision as of 14:23, 28 June 2012
Lithography
Vacuum Deposition
Dry Etch
Wet Processing
Thermal Processing
- Rapid Thermal Processor
- Strip Annealer
- Tube Furnace (Tystar 8300)
- Tube Furnace Wafer Bonding (Thermco)
- Tube Furnace AlGaAs Oxidation (Linberg)
Packaging
Inspection, Test and Characterization
- Field Emission SEM 1
- Field Emission SEM 2
- Step Profile
- Step Profilometer
- Ellipsometer
- Microscopes
- Probe Station & Curve Tracer
- Optical Film Thickness (Filmetrics)
- Scanning Probe Microscope
- Tencor Flexus Film Stress
- Optical Film Thickness (Nanometric)
- SEM Sample Coater
- Surface Analysis
- Photo-emission & IR Microscope
- Ellipsometer (Woollam)
- Goniometer
- 4-Point Probe Resistivity Mapper