Vacuum Deposition Recipes: Difference between revisions

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===Deposition Tools/Materials Table===
===Deposition Tools/Materials Table===
''The Key/Legend for this table's A...R6 values is at the [[bottom of the page]].''
''The Key/Legend for this table's A...R6 values is at the [https://wiki.nanofab.ucsb.edu/wiki/Vacuum_Deposition_Recipes?veaction=edit bottom of the page].''
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=== Process Ranking Table ===
===Process Ranking Table===
Processes in the table above are ranked by their "''Process Maturity Level''" as follows:
Processes in the table above are ranked by their "''Process Maturity Level''" as follows:
{| class="wikitable"
{| class="wikitable"
|'''Process Level'''
|'''Process Level'''
| colspan="11" | '''Description of Process Level Ranking'''
| colspan="11" |'''Description of Process Level Ranking'''
|-
|-
|A
|A

Revision as of 16:53, 5 August 2024

Process Control Data

See linked page for process control data (calibration data over time, such as dep. rate, refractive index, stress etc.) over time, for a selection of highly used tools/films.

Deposition Tools/Materials Table

The Key/Legend for this table's A...R6 values is at the bottom of the page.

Vacuum Deposition Recipes

 E-Beam Evaporation Sputtering Thermal Evaporation Plasma Enhanced Chemical
Vapor Deposition (PECVD) 		Atomic Layer Deposition Molecular Vapor Deposition
Material E-Beam 1 (Sharon) E-Beam 2 (Custom) E-Beam 3 (Temescal) E-Beam 4 (CHA) Sputter 3
(AJA ATC 2000-F) 		Sputter 4
(AJA ATC 2200-V) 		Sputter 5 (AJA ATC 2200-V) Ion Beam
Deposition (Veeco Nexus) 		Thermal
Evap 1 		Thermal Evap 2 (Solder) PECVD 1
(PlasmaTherm 790) 		PECVD 2
(Advanced Vacuum) 		Unaxis VLR ICP-PECVD Atomic Layer Deposition (Oxford FlexAL) Molecular Vapor Deposition (Tool)
Ag A
A A A A








Al A
A A A R1
R1 A A




Al2O3 A A

A R1
R5




R4
AlN



A A
R1




R4
Au A
A A A R1

A A




B














C R1
CeO2
CeO2 deposition (E-Beam 2)












Co A

A R









Cr A

A R


A A




Cu A


R1 A








Fe A

A R









Ge A
A A A A








GeO2 A
Gd A

A










Hf A













HfO2



A A






R4
In








A




Ir A













ITO
ITO deposition (E-Beam 2)

A A
R1






MgF2 A A
MgO A
Mo A


R A








Nb A



R








Nd



A








Ni A
A A R1


A A




NiCr A A
NiFe A A A
Pd A
A A



A A




Pt A
A A A R1 R1





R4
Ru A

A
R






R4
Si
A

R A
R1


R3

SiN



R1 A
R6

R6 R6 R6

SiN - Low Stress R4 R6 R6
SiO2 A A

R1 A A R6

R6 R6 R6 R4
SiOxNy






R3

R4



Sn








A




SrF2
A












Ta A


R1 A
R1






Ta2O5


A


R6






Ti A
A A R1 R1 R1 R1






TiN




R
R1




R4
TiW A


A R1








TiO2
A

A R1
R5




R4
V



A A








W A


A R1








Zn







A A




ZnO












R3
Zr A

A A A








ZrO2












R4
Material E-Beam 1 (Sharon) E-Beam 2 (Custom) E-Beam 3 (Temescal) E-Beam 4 (CHA) Sputter 3
(ATC 2000-F) 		Sputter 4
(ATC 2200-V) 		Sputter 5 (ATC 2200-V) Ion Beam
Deposition (Veeco Nexus) 		Thermal
Evap 1 		Thermal Evap 2 (Solder) PECVD 1
(PlasmaTherm 790) 		PECVD 2
(Advanced Vacuum) 		Unaxis VLR ICP-PECVD Atomic Layer Deposition (Oxford FlexAl) Molecular Vapor Deposition (Tool)

Process Ranking Table

Processes in the table above are ranked by their "Process Maturity Level" as follows:

Process Level Description of Process Level Ranking
A Process Allowed and materials available but never done
R1 Process has been ran at least once
R2 Process has been ran and/or procedure is documented or/and data available
R3 Process has been ran, procedure is documented, and data is available
R4 Process has a documented procedure with regular (≥4x per year) data or lookahead/in-Situ control available
R5 Process has a documented procedure with regular (≥4x per year) data and lookahead/in-Situ control available
R6 Process has a documented procedure, regular ( ≥4x per year) data, and control charts/limits available
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