Wafer Bonder (SUSS SB6-8E)

Wafer Bonder (SUSS SB6-8E) Location Bay 7 Tool Type Thermal Processing Manufacturer Karl Suss America Description Karl Suss Substrate Bonder Primary Supervisor Aidan Hopkins (805) 893-2343 hopkins@ece.ucsb.edu Secondary Supervisor Lee Sawyer Recipes SignupMonkey: Sign up for this tool

About

This is Karl-Suss model SB-6 substrate bonder. Wafer bonding of pieces to 6” wafers can be done at pressures from 5e-5 to 3e3 mBar and from 50°C to 550°C. This tool mates with the Karl-Suss MA-6 aligner to allow for aligned bonding. Forces up to 20 kN for a 150 mm wafer size are available. The system supports thermal compression as well as anodic bonding (up to 2000 V). The system is computer controlled with a windows environment allowing for multiple recipe steps and saving of recipes and data. The system is configured for manual loading of wafers.

Detailed Specifications

• Wafer bonding from 50°C to 550°C, +/- 5 degrees accuracy, +/- 3% uniformity
• Upper and lower heating of samples
• 5e-5 to 3e3 Torr environment bonding pressure, with Nitrogen
• Sample size: pieces to 6” wafers, aligned bonding by using the MA/BA-6 aligner - contact supervisor for setup.
• Anodic bonding to 2000 V
• Windows-based computer control
• Wafer bonder currently set up for 4" wafers

Documentation

• Bonder Pressure Rules Visual Aid
• Bonder Recipe Guidelines