Vacuum Deposition Recipes: Difference between revisions
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===[[Process Group - Process Control Data#Deposition .28Process Control Data.29|<u>Process Control Data</u>]]=== |
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{{Recipe Table Explanation}} |
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<small>''See [[Process Group - Process Control Data#Deposition .28Process Control Data.29|linked page]] for process control data (calibration data over time, such as dep. rate, refractive index, stress etc.) over time, for a selection of highly used tools/films.''</small> |
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===Deposition Tools/Materials Table=== |
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! width="1675" height="45" colspan="18" | <div style="font-size: 150%;">Vacuum Deposition Recipes</div> |
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''The Key/Legend for this table's <code>A...R6</code> values is at the [[Vacuum Deposition Recipes#Process Ranking Table|<u>bottom of the page</u>]].'' |
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! bgcolor="#D0E7FF" align="center" colspan="4" | '''[[E-Beam Evaporation Recipes|E-Beam Evaporation]]''' |
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! colspan="16" width="1675" height="45" |<div style="font-size: 150%;">Vacuum Deposition Recipes</div> |
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! bgcolor="#D0E7FF" align="center" colspan="6" | '''[[Sputtering Recipes|Sputtering]]''' |
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! bgcolor="#D0E7FF" align="center" colspan="2" | '''[[Thermal Evaporation Recipes|Thermal Evaporation]]''' |
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|<!-- INTENTIONALLY LEFT BLANK --><br> |
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! bgcolor="#D0E7FF" align="center" colspan="3" | '''[[PECVD Recipes|Plasma Enhanced Chemical<br>Vapor Deposition (PECVD)]]''' |
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! colspan="4" bgcolor="#d0e7ff" align="center" |'''[[E-Beam Evaporation Recipes|E-Beam Evaporation]]''' |
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! colspan="4" |'''[[Sputtering Recipes|Sputtering]]''' |
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! colspan="2" bgcolor="#d0e7ff" align="center" |'''[[Thermal Evaporation Recipes|Thermal Evaporation]]''' |
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! colspan="3" bgcolor="#d0e7ff" align="center" |'''[[PECVD Recipes|Plasma Enhanced Chemical<br>Vapor Deposition (PECVD)]]''' |
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! width="90" bgcolor="#d0e7ff" align="center" |'''[[Atomic Layer Deposition Recipes|Atomic Layer Deposition]]''' |
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! width="80" bgcolor="#d0e7ff" align="center" |'''[[Molecular Vapor Deposition Recipes|Molecular Vapor Deposition]]''' |
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! width="20" bgcolor="#d0e7ff" align="center" |'''Material''' |
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| width="65" bgcolor="# |
| width="65" bgcolor="#daf1ff" |[[E-Beam Evaporation Recipes#E-Beam_1_.28Sharon.29|E-Beam 1 (Sharon)]] |
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| width="65" bgcolor="# |
| width="65" bgcolor="#daf1ff" |[[E-Beam Evaporation Recipes#E-Beam_2_.28Custom.29|E-Beam 2 (Custom)]] |
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| width="65" bgcolor="# |
| width="65" bgcolor="#daf1ff" |[[E-Beam Evaporation Recipes#E-Beam_3_.28Temescal.29|E-Beam 3 (Temescal)]] |
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| width="65" bgcolor="# |
| width="65" bgcolor="#daf1ff" |[[E-Beam Evaporation Recipes#E-Beam_4_.28CHA.29|E-Beam 4 (CHA)]] |
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| width="65" bgcolor="# |
| width="65" bgcolor="#daf1ff" |[[Sputtering_Recipes#Sputter_3_.28AJA_ATC_2000-F.29|Sputter 3<br>(AJA ATC 2000-F)]] |
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| width="65" bgcolor="# |
| width="65" bgcolor="#daf1ff" |[[Sputtering_Recipes#Sputter_4_.28AJA_ATC_2200-V.29|Sputter 4<br>(AJA ATC 2200-V)]] |
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| width="65" bgcolor="# |
| width="65" bgcolor="#daf1ff" |[https://wiki.nanotech.ucsb.edu/w/index.php?title=Sputtering_Recipes#Sputter_5_.28AJA_ATC_2200-V.29 Sputter 5 (AJA ATC 2200-V)] |
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| width="55" bgcolor="#daf1ff" |[[Sputtering_Recipes#Ion_Beam_Deposition_.28Veeco_NEXUS.29|Ion Beam<br>Deposition (Veeco Nexus)]] |
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| width=" |
| width="45" bgcolor="#daf1ff" |[[Thermal Evaporation Recipes#Thermal_Evap_1|Thermal<br>Evap 1]] |
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| width=" |
| width="65" bgcolor="#daf1ff" |[[Thermal Evaporation Recipes#Thermal_Evap_2_.28Solder.29|Thermal Evap 2 (Solder)]] |
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| width=" |
| width="65" bgcolor="#daf1ff" |[[PECVD Recipes#PECVD_1_.28PlasmaTherm_790.29|PECVD 1<br>(PlasmaTherm 790)]] |
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| width="65" bgcolor="# |
| width="65" bgcolor="#daf1ff" |[[PECVD Recipes#PECVD_2_.28Advanced_Vacuum.29|PECVD 2<br>(Advanced Vacuum)]] |
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| width="65" bgcolor="# |
| width="65" bgcolor="#daf1ff" |[[PECVD_Recipes#ICP-PECVD_.28Unaxis_VLR.29|Unaxis VLR ICP-PECVD]] |
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| width="65" bgcolor="# |
| width="65" bgcolor="#daf1ff" |[[Atomic_Layer_Deposition_Recipes|Atomic Layer Deposition (Oxford FlexAL)]] |
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| width="65" bgcolor="# |
| width="65" bgcolor="#daf1ff" |[[Molecular Vapor Deposition|Molecular Vapor Deposition (Tool)]] |
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| width="65" bgcolor="#DAF1FF" | [[Atomic_Layer_Deposition_Recipes|Atomic Layer Deposition (Oxford FlexAL)]] |
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| width="65" bgcolor="#DAF1FF" | [[Molecular Vapor Deposition|Molecular Vapor Deposition (Tool)]] |
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! bgcolor="#d0e7ff" align="center" |Ag |
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| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 1 .28Sharon.29|R2]] |
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| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 3 .28Temescal.29|R2]] |
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| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 4 .28CHA.29|R2]] |
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| bgcolor="#eeffff" |[[Thermal Evaporation Recipes#Thermal Evaporator 1|R1]] |
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| bgcolor="EEFFFF" | {{rl|Atomic Layer Deposition Recipes|ZnO deposition (ALD)}} |
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! bgcolor="#d0e7ff" align="center" |Nb |
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| bgcolor="EEFFFF" | {{rl|Atomic Layer Deposition Recipes|ZrO2 deposition (ALD)}} |
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! |
! bgcolor="#d0e7ff" align="center" |Nd |
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| width="65" bgcolor="#DAF1FF" | [[E-Beam Evaporation Recipes#E-Beam_1_.28Sharon.29|E-Beam 1 (Sharon)]] |
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| width="65" bgcolor="#DAF1FF" | [[E-Beam Evaporation Recipes#E-Beam_3_.28Temescal.29|E-Beam 3 (Temescal)]] |
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| width="65" bgcolor="#DAF1FF" | [[E-Beam Evaporation Recipes#E-Beam_4_.28CHA.29|E-Beam 4 (CHA)]] |
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| width="65" bgcolor="#DAF1FF" | [[Sputtering Recipes#Sputter_1_.28Custom.29|Sputter 1 (Custom)]] |
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| width="65" bgcolor="#DAF1FF" | [[Sputtering_Recipes#Sputter_4_.28AJA_ATC_2200-V.29|Sputter 4<br>(ATC 2200-V)]] |
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| width="65" bgcolor="#DAF1FF" | [[Sputtering Recipes#Sputter_5_.28Lesker_AXXIS.29|Sputter 5 (Lesker AXXIS)]] |
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| width="45" bgcolor="#DAF1FF" | [[Thermal Evaporation Recipes#Thermal_Evap_1|Thermal<br>Evap 1]] |
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| width="65" bgcolor="#DAF1FF" | [[Thermal Evaporation Recipes#Thermal_Evap_2_.28Solder.29|Thermal Evap 2 (Solder)]] |
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| width="65" bgcolor="#DAF1FF" | [[PECVD Recipes#PECVD_1_.28PlasmaTherm_790.29|PECVD 1<br>(PlasmaTherm 790)]] |
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| width="65" bgcolor="#DAF1FF" | [[PECVD Recipes#PECVD_2_.28Advanced_Vacuum.29|PECVD 2<br>(Advanced Vacuum)]] |
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| width="65" bgcolor="#DAF1FF" | [[PECVD_Recipes#ICP-PECVD_.28Unaxis_VLR.29|Unaxis VLR ICP-PECVD]] |
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| width="65" bgcolor="#DAF1FF" | [[Atomic_Layer_Deposition_Recipes|Atomic Layer Deposition (Oxford FlexAl)]] |
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! bgcolor="#d0e7ff" align="center" |Ni |
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| width="65" bgcolor="#DAF1FF" | [[Molecular Vapor Deposition|Molecular Vapor Deposition (Tool)]] |
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| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 1 .28Sharon.29|R2]] |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 3 .28Temescal.29|R2]] |
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| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 4 .28CHA.29|R2]] |
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| bgcolor="#eeffff" |[[Sputtering Recipes|R3]] |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |[[Thermal Evaporation Recipes#Thermal Evaporator 1|R3]] |
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|[[E-Beam Evaporation Recipes#E-Beam 1 .28Sharon.29|R2]] |
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| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 1 .28Sharon.29|R1]] |
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| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 4 .28CHA.29|R2]] |
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|[[E-Beam Evaporation Recipes#E-Beam 1 .28Sharon.29|R2]] |
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|[[E-Beam Evaporation Recipes#E-Beam 3 .28Temescal.29|R2]] |
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|[[Thermal Evaporation Recipes#Thermal Evaporator 1|R3]] |
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! bgcolor="#d0e7ff" align="center" |Pt |
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| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 1 .28Sharon.29|R2]] |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 3 .28Temescal.29|R2]] |
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| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 4 .28CHA.29|R2]] |
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| bgcolor="#eeffff" |[[Sputtering Recipes|R3]] |
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| bgcolor="#eeffff" |[[Sputtering Recipes|R3]] |
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| bcolor="EEFFFF" |[[Sputtering Recipes|R3]] |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |[[Atomic Layer Deposition Recipes#Pt deposition .28ALD CHAMBER 1.29|R4]] |
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| bgcolor="#eeffff" |<br> |
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! bgcolor="#d0e7ff" align="center" |Ru |
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|[[E-Beam Evaporation Recipes#E-Beam 1 .28Sharon.29|R2]] |
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|[[E-Beam Evaporation Recipes#E-Beam 4 .28CHA.29|R2]] |
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|[[Sputtering Recipes#Ru Deposition .28Sputter 4.29|R3]] |
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|[[Atomic Layer Deposition Recipes#Pt deposition .28ALD CHAMBER 1.29|R4]] |
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! bgcolor="#d0e7ff" align="center" |Si |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 2 .28Custom.29|R2]] |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |[[Sputtering Recipes|R3]] |
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| bgcolor="#eeffff" |[[Sputtering Recipes|R1]] |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |R1 |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" | |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |[https://wiki.nanotech.ucsb.edu/w/index.php?title=PECVD_Recipes#Amorphous-Si_deposition_.28PECVD_.232.29 R3] |
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| bgcolor="#eeffff" | |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |<br> |
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! bgcolor="#d0e7ff" align="center" |SiN |
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|[[Sputtering Recipes|R3]] |
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|[[Sputtering Recipes|R1]] |
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|<br> |
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|[[Sputtering Recipes#Si3N4 deposition .28IBD.29|R6]] |
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|<br> |
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|[[PECVD Recipes#SiN deposition .28PECVD .231.29|R6]] |
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|[[PECVD Recipes#SiN deposition .28PECVD .232.29|R6]] |
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|[[PECVD Recipes#ICP-PECVD .28Unaxis VLR.29|R6]] |
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! bgcolor="#d0e7ff" align="center" |SiN - Low Stress |
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|[[PECVD Recipes#Low Stress Si3N4 .28PECVD.231.29|R4]] |
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|[[PECVD Recipes#Low-Stress SiN deposition .28PECVD .232.29|R6]] |
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|[[PECVD Recipes#ICP-PECVD .28Unaxis VLR.29|R6]] |
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! bgcolor="#d0e7ff" align="center" |SiO<sub>2</sub> |
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| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 1 .28Sharon.29|R2]] |
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| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 2 .28Custom.29|R2]] |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |[[Sputtering Recipes|R3]] |
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| bgcolor="#eeffff" |[[Sputtering Recipes|R1]] |
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| bgcolor="#eeffff" |[[Sputtering Recipes|R2]] |
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| bgcolor="#eeffff" |[[Sputtering_Recipes#SiO2_deposition_.28IBD.29|R6]] |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" | |
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| bgcolor="#eeffff" |[[PECVD Recipes#SiO2 deposition .28PECVD .231.29|R6]] |
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| bgcolor="#eeffff" |[[PECVD Recipes#SiO2 deposition .28PECVD .232.29|R6]] |
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| bgcolor="#eeffff" |[[PECVD Recipes#ICP-PECVD .28Unaxis VLR.29|R6]] |
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| bgcolor="#eeffff" |[[Atomic Layer Deposition Recipes#Pt deposition .28ALD CHAMBER 1.29|R4]] |
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| bgcolor="#eeffff" |<br> |
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|[[E-Beam Evaporation Recipes#E-Beam 2 .28Custom.29|R1]] |
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|[[Thermal Evaporation Recipes#Thermal Evaporator 1|R1]] |
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! bgcolor="#d0e7ff" align="center" |SiO<sub>x</sub>N<sub>y</sub> |
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|[[Sputtering Recipes#Si3N4 deposition .28IBD.29|R3]] |
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|[[PECVD Recipes#SiO2 deposition .28PECVD .231.29|R4]] |
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! bgcolor="#d0e7ff" align="center" |Sn |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |[[Thermal Evaporation Recipes#Thermal Evaporator 2|R2]] |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |<br> |
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|- |
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! bgcolor="#d0e7ff" align="center" |SrF<sub>2</sub> |
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|<br> |
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|[[E-Beam Evaporation Recipes#E-Beam 2 .28Custom.29|R2]] |
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|<br> |
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|[[Thermal Evaporation Recipes#Thermal Evaporator 1|R1]] |
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! bgcolor="#d0e7ff" align="center" |Ta |
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| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 1 .28Sharon.29|R1]] |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |[[Sputtering Recipes|R3]] |
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| bgcolor="#eeffff" |[[Sputtering Recipes|R1]] |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |R1 |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" | |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |<br> |
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|- |
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! bgcolor="#d0e7ff" align="center" |Ta<sub>2</sub>O<sub>5</sub> |
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|<br> |
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|[[E-Beam Evaporation Recipes#E-Beam 2 .28Custom.29|R1]] |
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|<br> |
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|[[E-Beam Evaporation Recipes#E-Beam 4 .28CHA.29|R1]] |
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|[[Sputtering Recipes#Si3N4 deposition .28IBD.29|R6]] |
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! bgcolor="#d0e7ff" align="center" |Ti |
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| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 1 .28Sharon.29|R2]] |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 3 .28Temescal.29|R2]] |
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| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 4 .28CHA.29|R2]] |
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| bgcolor="#eeffff" |[[Sputtering Recipes|R3]] |
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| bgcolor="#eeffff" |[[Sputtering Recipes|R3]] |
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| bgcolor="#eeffff" |[[Sputtering Recipes|R3]] |
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| bgcolor="#eeffff" |R1 |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" | |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |<br> |
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! bgcolor="#d0e7ff" align="center" |TiN |
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|<br> |
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|<br> |
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|[https://wiki.nanotech.ucsb.edu/w/index.php?title=Sputtering_Recipes#Sputter_4_.28AJA_ATC_2200-V.29 R3] |
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|<br> |
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|[[Atomic Layer Deposition Recipes#Pt deposition .28ALD CHAMBER 1.29|R4]] |
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|<br> |
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|- |
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! bgcolor="#d0e7ff" align="center" |TiW |
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| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 1 .28Sharon.29|R1]] |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |[[Sputtering Recipes|R2]] |
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| bgcolor="#eeffff" |[[Sputtering Recipes|R3]] |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |<br> |
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! bgcolor="#d0e7ff" align="center" |TiO<sub>2</sub> |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 2 .28Custom.29|R2]] |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |[[Sputtering Recipes|R1]] |
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| bgcolor="#eeffff" |[[Sputtering Recipes|R3]] |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |[[Sputtering Recipes#Si3N4 deposition .28IBD.29|R5]] |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" | |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |[[Atomic Layer Deposition Recipes#Pt deposition .28ALD CHAMBER 1.29|R4]] |
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| bgcolor="#eeffff" |<br> |
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|- |
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! bgcolor="#d0e7ff" align="center" |V |
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|<br> |
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|<br> |
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|<br> |
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|<br> |
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|[[Sputtering Recipes|R1]] |
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|[[Sputtering Recipes|R1]] |
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! bgcolor="#d0e7ff" align="center" |W |
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| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 1 .28Sharon.29|R2]] |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |[[Sputtering Recipes|R2]] |
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| bgcolor="#eeffff" |[[Sputtering Recipes|R3]] |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" | |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |<br> |
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! bgcolor="#d0e7ff" align="center" |Zn |
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|<br> |
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|<br> |
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|<br> |
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|<br> |
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|<br> |
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|[[Thermal Evaporation Recipes#Thermal Evaporator 1|R3]] |
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|[[Thermal Evaporation Recipes#Thermal Evaporator 2|R2]] |
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|<br> |
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| bgcolor="#eeffff" |[[Atomic Layer Deposition Recipes#Pt deposition .28ALD CHAMBER 1.29|R3]] |
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! bgcolor="#d0e7ff" align="center" |Zr |
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|[[E-Beam Evaporation Recipes#E-Beam 1 .28Sharon.29|R2]] |
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|[[E-Beam Evaporation Recipes#E-Beam 4 .28CHA.29|R2]] |
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|[[Sputtering Recipes|R1]] |
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|[[Sputtering Recipes|R1]] |
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|[[Thermal Evaporation Recipes#Thermal Evaporator 2|R1]] |
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! bgcolor="#d0e7ff" align="center" |ZrO<sub>2</sub> |
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| bgcolor="#eeffff" |[[Atomic Layer Deposition Recipes#Pt deposition .28ALD CHAMBER 1.29|R4]] |
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! width="20" bgcolor="#d0e7ff" align="center" |'''Material''' |
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| width="65" bgcolor="#daf1ff" |[[E-Beam Evaporation Recipes#E-Beam_1_.28Sharon.29|E-Beam 1 (Sharon)]] |
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| width="65" bgcolor="#daf1ff" |[[E-Beam Evaporation Recipes#E-Beam_2_.28Custom.29|E-Beam 2 (Custom)]] |
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| width="65" bgcolor="#daf1ff" |[[E-Beam Evaporation Recipes#E-Beam_3_.28Temescal.29|E-Beam 3 (Temescal)]] |
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| width="65" bgcolor="#daf1ff" |[[E-Beam Evaporation Recipes#E-Beam_4_.28CHA.29|E-Beam 4 (CHA)]] |
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| width="65" bgcolor="#daf1ff" |[[Sputtering Recipes#Sputter_3_.28ATC_2000-F.29|Sputter 3<br>(ATC 2000-F)]] |
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| width="65" bgcolor="#daf1ff" |[[Sputtering_Recipes#Sputter_4_.28AJA_ATC_2200-V.29|Sputter 4<br>(ATC 2200-V)]] |
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| width="65" bgcolor="#daf1ff" |[[Sputtering Recipes|Sputter 5 (ATC 2200-V)]] |
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| width="55" bgcolor="#daf1ff" |[[Sputtering_Recipes#Ion_Beam_Deposition_.28Veeco_NEXUS.29|Ion Beam<br>Deposition (Veeco Nexus)]] |
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| width="45" bgcolor="#daf1ff" |[[Thermal Evaporation Recipes#Thermal_Evap_1|Thermal<br>Evap 1]] |
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| width="65" bgcolor="#daf1ff" |[[Thermal Evaporation Recipes#Thermal_Evap_2_.28Solder.29|Thermal Evap 2 (Solder)]] |
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| width="65" bgcolor="#daf1ff" |[[PECVD Recipes#PECVD_1_.28PlasmaTherm_790.29|PECVD 1<br>(PlasmaTherm 790)]] |
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| width="65" bgcolor="#daf1ff" |[[PECVD Recipes#PECVD_2_.28Advanced_Vacuum.29|PECVD 2<br>(Advanced Vacuum)]] |
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| width="65" bgcolor="#daf1ff" |[[PECVD_Recipes#ICP-PECVD_.28Unaxis_VLR.29|Unaxis VLR ICP-PECVD]] |
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| width="65" bgcolor="#daf1ff" |[[Atomic_Layer_Deposition_Recipes|Atomic Layer Deposition (Oxford FlexAl)]] |
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| width="65" bgcolor="#daf1ff" |[[Molecular Vapor Deposition|Molecular Vapor Deposition (Tool)]] |
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===Process Ranking Table=== |
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Processes in the table above are ranked by their "''Process Maturity Level''" as follows: |
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{| class="wikitable" |
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|'''Process Level''' |
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| colspan="11" |'''Description of Process Level Ranking''' |
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|A |
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| colspan="11" |Process '''A'''llowed and materials available but never done |
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|- |
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|R1 |
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| colspan="11" |Process has been ran at least once |
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|- |
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|R2 |
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| colspan="11" |Process has been ran and/or procedure is documented or/and data available |
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|- |
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|R3 |
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| colspan="11" |Process has been ran, procedure is documented, and data is available |
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|- |
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|R4 |
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| colspan="11" |Process has a documented procedure with regular (≥4x per year) data '''or''' lookahead/in-Situ control available |
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|R5 |
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| colspan="11" |Process has a documented procedure with regular (≥4x per year) data '''and''' lookahead/in-Situ control available |
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|- |
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|R6 |
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| colspan="11" |Process has a documented procedure, regular ( ≥4x per year) data, and control charts/limits available |
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[[Category:Processing]] |
[[Category:Processing]] |
Latest revision as of 21:57, 7 November 2024
Process Control Data
See linked page for process control data (calibration data over time, such as dep. rate, refractive index, stress etc.) over time, for a selection of highly used tools/films.
Deposition Tools/Materials Table
The Key/Legend for this table's A...R6
values is at the bottom of the page.
Process Ranking Table
Processes in the table above are ranked by their "Process Maturity Level" as follows:
Process Level | Description of Process Level Ranking | ||||||||||
A | Process Allowed and materials available but never done | ||||||||||
R1 | Process has been ran at least once | ||||||||||
R2 | Process has been ran and/or procedure is documented or/and data available | ||||||||||
R3 | Process has been ran, procedure is documented, and data is available | ||||||||||
R4 | Process has a documented procedure with regular (≥4x per year) data or lookahead/in-Situ control available | ||||||||||
R5 | Process has a documented procedure with regular (≥4x per year) data and lookahead/in-Situ control available | ||||||||||
R6 | Process has a documented procedure, regular ( ≥4x per year) data, and control charts/limits available |