Thermal Processing Recipes: Difference between revisions
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Online calculators for thermal oxidation can be used to estimate the oxidation time for a desired oxidation thickness. |
Online calculators for thermal oxidation can be used to estimate the oxidation time for a desired oxidation thickness. |
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Please see [[Calculators + Utilities]] page for links to these oxidation calculators. |
Please see the [[Calculators + Utilities]] page for links to these oxidation calculators. |
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Thermal oxidation recipes for Wet (H2O vapor) and Dry (O2 gas) oxidation up to 1050°C are available on the [[Tube Furnace (Tystar 8300)|TyStar 8300 system]]. |
Thermal oxidation recipes for Wet (H2O vapor) and Dry (O2 gas) oxidation up to 1050°C are available on the [[Tube Furnace (Tystar 8300)|TyStar 8300 system]]. |
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Revision as of 06:56, 16 November 2017
Thermal Oxidation of Silicon
Online calculators for thermal oxidation can be used to estimate the oxidation time for a desired oxidation thickness.
Please see the Calculators + Utilities page for links to these oxidation calculators.
Thermal oxidation recipes for Wet (H2O vapor) and Dry (O2 gas) oxidation up to 1050°C are available on the TyStar 8300 system.
Wafer Substrate Bonding
Numerous research groups perform wafer bonding using either the Suss Wafer Bonder or a custom graphite fixture and any one of numerous ovens, such as the N2-purged Wafer Bonding Furnace (with glove box) or N2-purged Blue M oven.
The EVG Plasma Activation system and Goniometer allow for surface prep/inspection prior to bonding.