Tool List

Lithography

Suss Aligners (MJB-3) IR Aligner (MJB-3 IR) DUV Flood Expose Ovens

Stepper 1 (GCA 6300) Stepper 2 (AutoStep 200) Stepper 3 (ASML) E-Beam Lithography System Nano-Imprint Tool (Nanonex NX2000)

Vacuum Deposition

E-Beam 1 E-Beam 2 E-Beam 3 E-Beam 4 Sputter 1 Sputter 2 Sputter 3 Sputter 4

Sputter 5 PECVD 1 PECVD 2 Unaxis VLR ICP-PECVD IBD Molecular Vapor Deposition Atomic Layer Deposision

Dry Etch

RIE 1 RIE 2 RIE 3 RIE 5 Si Deep RIE Ashers Unaxis VLR ICP-Etch

ICP Etch 1 ICP Etch 2 UV Ozone Reactor Plasma Clean XeF2 Etch Plasma Activation Tool

Wet Processing

• Wet Benches
• Gold Plating Bench
• Critical Point Dryer
• Spin Rinse Dryer

Thermal Processing

• Rapid Thermal Processor
• Strip Annealer
• Tube Furnace (Tystar 8300)
• Tube Furnace Wafer Bonding (Thermco)
• Tube Furnace AlGaAs Oxidation (Linberg)

Packaging

• Flip-Chip Bonder
• Vacuum Sealer
• Dicing Saw

Inspection, Test and Characterization

• Field Emission SEM 1
• Field Emission SEM 2
• Step Profile
• Step Profilometer
• Ellipsometer
• Microscopes
• Probe Station & Curve Tracer
• Optical Film Thickness (Filmetrics)
• Scanning Probe Microscope
• Tencor Flexus Film Stress
• Optical Film Thickness (Nanometric)
• SEM Sample Coater
• Surface Analysis
• Photo-emission & IR Microscope
• Ellipsometer (Woollam)
• Goniometer
• 4-Point Probe Resistivity Mapper