Lee Sawyer: Difference between revisions
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(→Tools: Added and linked MA-6, MJBs, DUV, MVD and RIE 2 and 3 under my tools) |
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{{staff|{{PAGENAME}} |
{{staff|{{PAGENAME}} |
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|position = |
|position = Equipment Engineer |
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|room = 1109F |
|room = 1109F |
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|phone = |
|phone = (805) 893-2123 |
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|cell = |
|cell = |
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|email = lee_sawyer@ucsb.edu |
|email = lee_sawyer@ucsb.edu |
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=Tools= |
=Tools= |
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Lee Sawyer is in charge of the following tools: |
Lee Sawyer is in charge of the following tools: |
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{| |
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|- valign="top" |
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* [[Contact Aligner (SUSS MA-6)]] |
* [[Contact Aligner (SUSS MA-6)]] |
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* [[Suss Aligners (SUSS MJB-3)]] |
* [[Suss Aligners (SUSS MJB-3)]] |
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* [[ |
* [[Wafer Bonder (SUSS SB6-8E)]] |
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* [[DUV Flood Expose]] |
* [[DUV Flood Expose]] |
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* [[Molecular Vapor Deposition]] |
* [[Molecular Vapor Deposition]] |
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* [[ICP Etch 1 (Panasonic E626I)]] |
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* [[RIE 2 (MRC)]] |
* [[RIE 2 (MRC)]] |
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* [[RIE 3 (MRC)]] |
* [[RIE 3 (MRC)]] |
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* [[UV Ozone Reactor]] |
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* [[Plasma Activation (EVG 810)]] |
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* [[Dicing Saw (ADT)]] |
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* [[Goniometer (Rame-Hart A-100)]] |
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* [[Plasma Clean (YES EcoClean)]] |
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* [[Film Stress (Tencor Flexus)]] |
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* [[Maskless Aligner (Heidelberg MLA150)]] |
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* [[E-Beam 2 (Custom)]] |
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Latest revision as of 16:59, 28 October 2021
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About
Current Work
Tools
Lee Sawyer is in charge of the following tools: