Lee Sawyer: Difference between revisions
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* [[RIE 3 (MRC)]] |
* [[RIE 3 (MRC)]] |
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* [[UV Ozone Reactor]] |
* [[UV Ozone Reactor]] |
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* [[Plasma Activation (EVG 810)]] |
* [[Plasma Activation (EVG 810)]] |
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* [[Dicing Saw (ADT)]] |
* [[Dicing Saw (ADT)]] |
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Revision as of 03:40, 28 October 2021
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About
Current Work
Tools
Lee Sawyer is in charge of the following tools:
- Contact Aligner (SUSS MA-6)
- Suss Aligners (SUSS MJB-3)
- Wafer Bonder (SUSS SB6-8E)
- DUV Flood Expose
- Molecular Vapor Deposition
- ICP Etch 1 (Panasonic E626I)
- RIE 2 (MRC)
- RIE 3 (MRC)
- UV Ozone Reactor
- Plasma Activation (EVG 810)
- Dicing Saw (ADT)
- Goniometer (Rame-Hart A-100)
- Plasma Clean (YES EcoClean)
- Film Stress (Tencor Flexus)
- Maskless Aligner (Heidelberg MLA150)