Tool List: Difference between revisions
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* [[Suss Aligners (MJB-3)]] |
* [[Suss Aligners (SUSS MJB-3)]] |
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* [[IR Aligner (MJB-3 IR)]] |
* [[IR Aligner (SUSS MJB-3 IR)]] |
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* [[DUV Flood Expose]] |
* [[DUV Flood Expose]] |
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* [[Ovens]] |
* [[Ovens]] |
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* [[Stepper 2 (AutoStep 200)]] |
* [[Stepper 2 (AutoStep 200)]] |
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* [[Stepper 3 (ASML)]] |
* [[Stepper 3 (ASML)]] |
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* [[E-Beam Lithography System]] |
* [[E-Beam Lithography System (JEOL JBX-6300FS)]] |
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* [[Nano-Imprint Tool (Nanonex NX2000)]] |
* [[Nano-Imprint Tool (Nanonex NX2000)]] |
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* [[Contact Aligner (SUSS MA-6)]] |
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* [[Wafer Bonder (SUSS SB6-8E)]] |
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Revision as of 18:28, 28 June 2012
Lithography
Vacuum Deposition
Dry Etch
Wet Processing
Thermal Processing
- Rapid Thermal Processor
- Strip Annealer
- Tube Furnace (Tystar 8300)
- Tube Furnace Wafer Bonding (Thermco)
- Tube Furnace AlGaAs Oxidation (Linberg)
Packaging
Inspection, Test and Characterization
- Field Emission SEM 1
- Field Emission SEM 2
- Step Profile
- Step Profilometer
- Ellipsometer
- Microscopes
- Probe Station & Curve Tracer
- Optical Film Thickness (Filmetrics)
- Scanning Probe Microscope
- Tencor Flexus Film Stress
- Optical Film Thickness (Nanometric)
- SEM Sample Coater
- Surface Analysis
- Photo-emission & IR Microscope
- Ellipsometer (Woollam)
- Goniometer
- 4-Point Probe Resistivity Mapper