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- 11:13, 30 August 2022 diff hist +24 Tube Furnace AlGaAs Oxidation (Lindberg) current
- 11:11, 30 August 2022 diff hist +21 Tube Furnace Wafer Bonding (Thermco)
- 11:10, 30 August 2022 diff hist +21 Rapid Thermal Processor (AET RX6)
- 11:03, 30 August 2022 diff hist +23 Chemical-Mechanical Polisher (Logitech) current
- 11:02, 30 August 2022 diff hist +27 Spin Rinse Dryer (SemiTool) current
- 11:01, 30 August 2022 diff hist +24 Critical Point Dryer
- 11:00, 30 August 2022 diff hist +24 Wet Benches →Plating Bench
- 10:59, 30 August 2022 diff hist +24 Wet Benches →HF/TMAH Processing Bench
- 10:59, 30 August 2022 diff hist +25 Wet Benches →Toxic Corrosive Benches
- 10:58, 30 August 2022 diff hist +24 Wet Benches →Develop Benches
- 10:57, 30 August 2022 diff hist +24 Wet Benches →Spin Coat Benches
- 10:56, 30 August 2022 diff hist +24 Wet Benches →Solvent Cleaning Benches
- 10:55, 30 August 2022 diff hist +23 XeF2 Etch (Xetch)
- 10:54, 30 August 2022 diff hist +24 Plasma Activation (EVG 810)
- 10:53, 30 August 2022 diff hist +21 Vapor HF Etch current
- 10:52, 30 August 2022 diff hist +21 UV Ozone Reactor
- 10:51, 30 August 2022 diff hist +21 CAIBE (Oxford Ion Mill)
- 10:50, 30 August 2022 diff hist +21 Ashers (Technics PEII)
- 10:50, 30 August 2022 diff hist +24 Plasma Clean (YES EcoClean)
- 10:49, 30 August 2022 diff hist +24 DSEIII (PlasmaTherm/Deep Silicon Etcher)
- 10:48, 30 August 2022 diff hist +24 Fluorine ICP Etcher (PlasmaTherm/SLR Fluorine ICP)
- 10:47, 30 August 2022 diff hist +25 Oxford ICP Etcher (PlasmaPro 100 Cobra)
- 10:46, 30 August 2022 diff hist +23 ICP-Etch (Unaxis VLR)
- 10:45, 30 August 2022 diff hist +23 ICP Etch 2 (Panasonic E626I)
- 10:45, 30 August 2022 diff hist +23 ICP Etch 1 (Panasonic E646V)
- 10:44, 30 August 2022 diff hist +24 RIE 5 (PlasmaTherm)
- 10:42, 30 August 2022 diff hist +24 RIE 3 (MRC)
- 10:41, 30 August 2022 diff hist +24 RIE 2 (MRC)
- 10:39, 30 August 2022 diff hist +24 SEM Sample Coater (Hummer)
- 10:38, 30 August 2022 diff hist +27 Ion Beam Deposition (Veeco NEXUS)
- 10:37, 30 August 2022 diff hist +21 Sputter 5 (AJA ATC 2200-V)
- 10:37, 30 August 2022 diff hist +21 Sputter 4 (AJA ATC 2200-V) current
- 10:36, 30 August 2022 diff hist +21 Sputter 3 (AJA ATC 2000-F) current
- 10:36, 30 August 2022 diff hist +21 Atomic Layer Deposition (Oxford FlexAL)
- 10:34, 30 August 2022 diff hist +24 Molecular Vapor Deposition current
- 10:31, 30 August 2022 diff hist +23 ICP-PECVD (Unaxis VLR)
- 10:30, 30 August 2022 diff hist +27 PECVD 2 (Advanced Vacuum)
- 10:30, 30 August 2022 diff hist +27 PECVD 1 (PlasmaTherm 790) current
- 10:29, 30 August 2022 diff hist +27 Thermal Evap 2 (Solder) current
- 10:28, 30 August 2022 diff hist +27 Thermal Evap 1 current
- 10:27, 30 August 2022 diff hist +29 E-Beam 4 (CHA)
- 10:25, 30 August 2022 diff hist +28 E-Beam 3 (Temescal)
- 10:24, 30 August 2022 diff hist +23 E-Beam 2 (Custom)
- 10:24, 30 August 2022 diff hist +1 E-Beam 1 (Sharon)
- 10:23, 30 August 2022 diff hist +26 E-Beam 1 (Sharon)
- 10:22, 30 August 2022 diff hist +29 High Temp Oven (Blue M)
- 10:21, 30 August 2022 diff hist +3 Oven 5 (Labline) current
- 10:21, 30 August 2022 diff hist +26 Oven 5 (Labline)
- 10:19, 30 August 2022 diff hist +1 Oven 4 (Thermo-Fisher HeraTherm)
- 10:19, 30 August 2022 diff hist +28 Oven 4 (Thermo-Fisher HeraTherm)