Difference between revisions of "Lee Sawyer"
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* [[RIE 2 (MRC)]] | * [[RIE 2 (MRC)]] | ||
* [[RIE 3 (MRC)]] | * [[RIE 3 (MRC)]] | ||
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* [[UV Ozone Reactor]] | * [[UV Ozone Reactor]] | ||
* [[Plasma Activation (EVG 810)]] | * [[Plasma Activation (EVG 810)]] | ||
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* [[Film Stress (Tencor Flexus)]] | * [[Film Stress (Tencor Flexus)]] | ||
* [[Maskless Aligner (Heidelberg MLA150)]] | * [[Maskless Aligner (Heidelberg MLA150)]] | ||
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Revision as of 20:43, 27 October 2021
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About
Current Work
Tools
Lee Sawyer is in charge of the following tools:
- Contact Aligner (SUSS MA-6)
- Suss Aligners (SUSS MJB-3)
- Wafer Bonder (SUSS SB6-8E)
- DUV Flood Expose
- Molecular Vapor Deposition
- ICP Etch 1 (Panasonic E626I)
- RIE 2 (MRC)
- RIE 3 (MRC)
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- UV Ozone Reactor
- Plasma Activation (EVG 810)
- Dicing Saw (ADT)
- Goniometer (Rame-Hart A-100)
- Plasma Clean (YES EcoClean)
- Film Stress (Tencor Flexus)
- Maskless Aligner (Heidelberg MLA150)
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