Lithography Recipes: Difference between revisions

From UCSB Nanofab Wiki
Jump to navigation Jump to search
(→‎General Information: remove doubled TOC)
m (→‎Photolithography Recipes: tidy up, split into separate rows)
Line 4: Line 4:
!Table of Contents
!Table of Contents
|-
|-
|
|'''<u><big>Photolithography Processes</big></u>'''
=== '''<big>Photolithography Processes</big>''' ===
*'''UV Optical Lithography'''
**[[#Photolithography_Recipes |Photo Lithography Recipe section]]
#'''UV Optical Lithography'''
#*[[#Photolithography_Recipes |Photo Lithography Recipe section]]
***''Has links to starting recipes (spin, bake, exposure, develop etc.) for Contact Aligners, Steppers and Maskless Aligner.''
#**''Has links to starting recipes (spin, bake, exposure, develop etc.) for Contact Aligners, Steppers and Maskless Aligner.''
***''Substrate, surface materials, pattern size can often affect process parameters. Users may need to run Focus/Exposure Arrays/Matrix (FEA's/FEM's) with these processes to achieve high-resolution.''
#**''Substrate, surface materials, pattern size can often affect process parameters. Users may need to run Focus/Exposure Arrays/Matrix (FEA's/FEM's) with these processes to achieve high-resolution.''
**[[#PositivePR |Stocked Lithography Chemical + Datasheets]]
#*[[#PositivePR |Stocked Lithography Chemical + Datasheets]]
***''Lists all stocked photolith. chemicals, PRs, strippers, developers, and links to the chemical's application notes/datasheet, which detail the spin curves and nominal processes.''
#**''Lists all stocked photolith. chemicals, PRs, strippers, developers, and links to the chemical's application notes/datasheet, which detail the spin curves and nominal processes.''
*'''[[Lithography Recipes#Lift-Off Recipes|Lift-Off Recipes]]'''
#'''[[Lithography Recipes#Lift-Off Recipes|Lift-Off Recipes]]'''
**''Verified Recipes for lift-off using various photolith. tools''
#*''Verified Recipes for lift-off using various photolith. tools''
**''General educational description of this technique and it's limitations/considerations.''
#*''General educational description of this technique and it's limitations/considerations.''
*'''E-beam Lithography'''
**[[#E-Beam_Lithography_Recipes |E-Beam Lithography Recipes]]
#'''E-beam Lithography'''
#*[[#E-Beam_Lithography_Recipes |E-Beam Lithography Recipes]]
***''Has links to starting recipes. Substrates and patterns play a large role in process parameters.''
#**''Has links to starting recipes. Substrates and patterns play a large role in process parameters.''
**[[#EBLPR |EBL Photoresist Datasheets]]
#*[[#EBLPR |EBL Photoresist Datasheets]]
***''Provided for reference, also showing starting recipes and usage info.''
#**''Provided for reference, also showing starting recipes and usage info.''
*'''[[Lithography Recipes#Holography Recipes|Holography]]'''
#'''[[Lithography Recipes#Holography Recipes|Holography]]'''
**''For 1-D and 2-D gratings with 220nm nominal period, available on substrates up to 1 inch square.''
#*''For 1-D and 2-D gratings with 220nm nominal period, available on substrates up to 1 inch square.''
**''Recipes for silicon substrates are provided, and have been translated to other substrates by users.''
#*''Recipes for silicon substrates are provided, and have been translated to other substrates by users.''
*'''[[#NanoImprinting |Nanoimprinting Resists]]'''
#'''[[#NanoImprinting |Nanoimprinting Resists]]'''
**''Datasheets are provided with starting recipes and usage info.''
#*''Datasheets are provided with starting recipes and usage info.''
**''Recipes provided are for use in the [[Nano-Imprint_(Nanonex_NX2000) |Nano-Imprint (Nanonex NX2000)]] system only.''
#*''Recipes provided are for use in the [[Nano-Imprint_(Nanonex_NX2000) |Nano-Imprint (Nanonex NX2000)]] system only.''

|-
⚫
<u>'''<big>Photolithography Chemicals/Materials</big>'''</u>
|
⚫
*'''[[#Underlayers |Underlayers]]'''
⚫
=== '''<big>Photolithography Chemicals/Materials</big>''' ===
⚫
**''These are used beneath resists for both adhesive purposes and to enable bi-layer lift-off profiles for use with photoresist.''
⚫
#'''[[#Underlayers |Underlayers]]'''
⚫
**''Datasheets are provided.''
⚫
#*''These are used beneath resists for both adhesive purposes and to enable bi-layer lift-off profiles for use with photoresist.''
⚫
*'''[[#AntiReflectionCoatings |Anti-Reflection Coatings]]''':
⚫
#*''Datasheets are provided.''
⚫
**[[#Photolithography_Recipes |The Photoresist Recipes]] section contains recipes using these materials.
⚫
#'''[[#AntiReflectionCoatings |Anti-Reflection Coatings]]''':
⚫
**''Bottom Anti-Reflection Coatings (BARC) are used in the stepper systems, underneath the resists to eliminate substrate reflections that can affect resolution and repeatability for small, near resolution limited, feature sizes.''
⚫
#*[[#Photolithography_Recipes |The Photoresist Recipes]] section contains recipes using these materials.
⚫
**''Datasheets are provided for reference on use of the materials.''
⚫
#*''Bottom Anti-Reflection Coatings (BARC) are used in the stepper systems, underneath the resists to eliminate substrate reflections that can affect resolution and repeatability for small, near resolution limited, feature sizes.''
⚫
*'''[[#ContrastEnhancement |Contrast Enhancement Materials (CEM)]]'''
⚫
#*''Datasheets are provided for reference on use of the materials.''
⚫
**[[#Photolithography_Recipes |The Photoresist Recipes]] section contains recipes using these materials.
⚫
#'''[[#ContrastEnhancement |Contrast Enhancement Materials (CEM)]]'''
⚫
**''Used for resolution enhancement. Not for use in contact aligners, typically used on I-Line Steppers.''
⚫
#*[[#Photolithography_Recipes |The Photoresist Recipes]] section contains recipes using these materials.
⚫
**''Datasheets provided with usage info.''
⚫
#*''Used for resolution enhancement. Not for use in contact aligners, typically used on I-Line Steppers.''
⚫
*'''[[#AdhesionPromoters |Adhesion Promoters]]'''
⚫
#*''Datasheets provided with usage info.''
⚫
**''These are used to improve wetting of photoresists to your substrate.''
⚫
#'''[[#AdhesionPromoters |Adhesion Promoters]]'''
⚫
**''Datasheets are provided on use of these materials.''
⚫
#*''These are used to improve wetting of photoresists to your substrate.''

⚫
#*''Datasheets are provided on use of these materials.''
⚫
*'''[[#SpinOnDielectrics |Low-K Spin-on Dielectrics]]'''
**[[Lithography Recipes#SpinOnDielectrics|Spin-On Dielectrics]]
#'''[[#SpinOnDielectrics |Low-K Spin-on Dielectrics]]'''
⚫
#*[[Lithography Recipes#SpinOnDielectrics|Spin-On Dielectrics]]
***''Datasheets for BCB, Photo-BCB, and SOG (spin-on-glass) for reference on use.''
#**''Datasheets for BCB, Photo-BCB, and SOG (spin-on-glass) for reference on use.''
**[[#Low-K_Spin-On_Dielectric_Recipes |Low-K Spin-On Dielectric Recipes]]
#*[[#Low-K_Spin-On_Dielectric_Recipes |Low-K Spin-On Dielectric Recipes]]
***''Recipes for usage of some spin-on dielectrics.''
#**''Recipes for usage of some spin-on dielectrics.''
*'''[[#Developers |Developers and Removers]]'''
#'''[[#Developers |Developers and Removers]]'''
**''Datasheets provided for reference.''
#*''Datasheets provided for reference.''
**''Remover and Photoresist Strippers are used to dissolve PR during lift-off or after etching.''
#*''Remover and Photoresist Strippers are used to dissolve PR during lift-off or after etching.''
|}
|}


Line 55: Line 56:


{{Recipe Table Explanation}}
{{Recipe Table Explanation}}
''Click the tool title to go to recipes for that tool. Click the photoresist title to get the datasheet, also in [[Lithography Recipes#Chemicals Stocked .2B Datasheets|Stocked Chemicals + Datasheets]].''
''Click the tool title to go to recipes for that tool.''

''Click the photoresist title to get the datasheet, also found in [[Lithography Recipes#Chemicals Stocked .2B Datasheets|Stocked Chemicals + Datasheets]].''
{| class="wikitable" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center;" border="1"
{| class="wikitable" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center;" border="1"
|-
|-
Line 64: Line 67:
! colspan="2" align="center" |'''[[Contact Alignment Recipes|<big>Contact Aligner Recipes</big>]]'''
! colspan="2" align="center" |'''[[Contact Alignment Recipes|<big>Contact Aligner Recipes</big>]]'''
! colspan="3" align="center" |'''[[Stepper Recipes|<big>Stepper Recipes</big>]]'''
! colspan="3" align="center" |'''[[Stepper Recipes|<big>Stepper Recipes</big>]]'''
! align="center" |Other
! align="center" |[[Direct-Write Lithography Recipes|Direct-Write Litho. Recipes]]
|-
|-
! width="150" bgcolor="#D0E7FF" align="center" |'''Positive Resists'''
! width="150" bgcolor="#D0E7FF" align="center" |'''Positive Resists'''

Revision as of 05:02, 15 November 2020

Table of Contents

Photolithography Processes

  1. UV Optical Lithography
    • Photo Lithography Recipe section
      • Has links to starting recipes (spin, bake, exposure, develop etc.) for Contact Aligners, Steppers and Maskless Aligner.
      • Substrate, surface materials, pattern size can often affect process parameters. Users may need to run Focus/Exposure Arrays/Matrix (FEA's/FEM's) with these processes to achieve high-resolution.
    • Stocked Lithography Chemical + Datasheets
      • Lists all stocked photolith. chemicals, PRs, strippers, developers, and links to the chemical's application notes/datasheet, which detail the spin curves and nominal processes.
  2. Lift-Off Recipes
    • Verified Recipes for lift-off using various photolith. tools
    • General educational description of this technique and it's limitations/considerations.
  3. E-beam Lithography
  4. Holography
    • For 1-D and 2-D gratings with 220nm nominal period, available on substrates up to 1 inch square.
    • Recipes for silicon substrates are provided, and have been translated to other substrates by users.
  5. Nanoimprinting Resists

Photolithography Chemicals/Materials

  1. Underlayers
    • These are used beneath resists for both adhesive purposes and to enable bi-layer lift-off profiles for use with photoresist.
    • Datasheets are provided.
  2. Anti-Reflection Coatings:
    • The Photoresist Recipes section contains recipes using these materials.
    • Bottom Anti-Reflection Coatings (BARC) are used in the stepper systems, underneath the resists to eliminate substrate reflections that can affect resolution and repeatability for small, near resolution limited, feature sizes.
    • Datasheets are provided for reference on use of the materials.
  3. Contrast Enhancement Materials (CEM)
    • The Photoresist Recipes section contains recipes using these materials.
    • Used for resolution enhancement. Not for use in contact aligners, typically used on I-Line Steppers.
    • Datasheets provided with usage info.
  4. Adhesion Promoters
    • These are used to improve wetting of photoresists to your substrate.
    • Datasheets are provided on use of these materials.
  5. Low-K Spin-on Dielectrics
  6. Developers and Removers
    • Datasheets provided for reference.
    • Remover and Photoresist Strippers are used to dissolve PR during lift-off or after etching.

Photolithography Recipes

  • R = Recipe is available. Clicking this link will take you to the recipe.
  • A = Material is available for use, but no recipes are provided.

Click the tool title to go to recipes for that tool.

Click the photoresist title to get the datasheet, also found in Stocked Chemicals + Datasheets.

Photolithography Recipes
Contact Aligner Recipes Stepper Recipes Direct-Write Litho. Recipes
Positive Resists SUSS MJB-3 SUSS MA-6 Stepper 1
(GCA 6300) 		Stepper 2
(AutoStep 200) 		Stepper 3
(ASML DUV) 		MLA150
(Heidelberg)
AZ4110 R1 R1 A A R1
AZ4210 R1 R1 A A
AZ4330RS R1 R1 A A R1
AZ4620 A A A A A
OCG 825-35CS A A A A
SPR 955 CM-0.9 A R1 R1 R1 R1
SPR 955 CM-1.8 A A R1 R1
SPR 220-3.0 R1 R1 R1 R1 R1
SPR 220-7.0 R1 R1 R1 R1
THMR-IP3600 HP D A A R1
UV6-0.8 R1
UV210-0.3 R1
UV26-2.5 A
Negative Resists SUSS MJB-3 SUSS MA-6 Stepper 1
(GCA 6300) 		Stepper 2
(AutoStep 200) 		Stepper 3
(ASML DUV) 		MLA150
(Heidelberg)
AZ5214-EIR R1 R1 R1 R1 R1
AZnLOF 2020 R1 R1 R1 R1 R1
AZnLOF 2035 A A A A
AZnLOF 2070 A A A A
AZnLOF 5510 A A R1 R1
UVN30-0.8 R1
SU-8 2005,2010,2015 A R1 A A
SU-8 2075 A A A A R1
NR9-1000,3000,6000PY R1 R1 A R1
Anti-Reflection Coatings SUSS MJB-3 SUSS MA-6 Stepper 1
(GCA 6300) 		Stepper 2
(AutoStep 200) 		Stepper 3
(ASML DUV) 		MLA150
(Heidelberg)
DUV42-P R1
DS-K101-304 R1
SUSS MJB-3 SUSS MA-6 Stepper 1
(GCA 6300) 		Stepper 2
(AutoStep 200) 		Stepper 3
(ASML DUV) 		MLA150
(Heidelberg)

Lift-Off Recipes

E-Beam Lithography Recipes (JEOL JBX-6300FS)

  • Under Development.

FIB Lithography Recipes (Raith Velion)

To Be Added

Automated Coat/Develop System Recipes (S-Cubed Flexi)

Recipes pre-loaded on the S-Cubed Flexi automated coat/bake/develop system. Only staff may write new recipes, contact the tool supervisor for more info.

To Be Added

Nanoimprinting Recipes

Holography Recipes

Low-K Spin-On Dielectric Recipes

Chemicals Stocked + Datasheets

The following is a list of the lithography chemicals we stock in the lab, with links to the datasheets for each. The datasheets will often have important processing info such as spin-speed vs. thickness curves, typical process parameters, bake temps/times etc.

Positive Photoresists

i-line and broadband

DUV-248nm

Negative Photoresists

i-line and broadband

DUV-248nm

Underlayers
E-beam resists
Nanoimprinting
Contrast Enhancement Materials
Anti-Reflection Coatings
Adhesion Promoters
Spin-On Dielectrics

Low-K Spin-On Dielectrics such as Benzocyclobutane and Spin-on Glass

Developers
Photoresist Removers
Retrieved from "https://wiki.nanofab.ucsb.edu/w/index.php?title=Lithography_Recipes&oldid=158612"