Tool List: Difference between revisions

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* [[E-Beam 3]]
* [[E-Beam 3]]
* [[E-Beam 4]]
* [[E-Beam 4]]
* [[Sputter 1]]
* [[Sputter 1 (Custom)]]
* [[Sputter 2]]
* [[Sputter 2 (SFI Endeavor)]]
* [[Sputter 3]]
* [[Sputter 3]]
* [[Sputter 4]]
* [[Sputter 4]]
|width=200|
|width=200|
* [[Sputter 5]]
* [[Sputter 5 (Lesker AXXIS)]]
* [[PECVD 1]]
* [[PECVD 1]]
* [[PECVD 2]]
* [[PECVD 2 (Advanced Vacuum)]]
* [[Unaxis VLR ICP-PECVD]]
* [[Unaxis VLR ICP-PECVD]]
* [[IBD]]
* [[IBD]]
* [[Molecular Vapor Deposition]]
* [[Molecular Vapor Deposition]]
* [[Atomic Layer Deposision]]
* [[Atomic Layer Deposision (Oxford Flexal)]]
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=Dry Etch=
=Dry Etch=
{|
{|

Revision as of 18:30, 28 June 2012

Lithography

Vacuum Deposition

Dry Etch

Wet Processing

Thermal Processing

Packaging

Inspection, Test and Characterization

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