Tool List

Lithography

Suss Aligners (SUSS MJB-3) IR Aligner (SUSS MJB-3 IR) DUV Flood Expose Ovens 1, 2 & 3 (Labline) Oven 4 (Fisher) Oven 5 (Blue M) Vacuum Oven (YES) Holographic Lith/PL Setup

Stepper 1 (GCA 6300) Stepper 2 (AutoStep 200) Stepper 3 (ASML) E-Beam Lithography System (JEOL JBX-6300FS) AFM-based Nanolithography Tool (NanoMan) Nano-Imprint Tool (Nanonex NX2000) Contact Aligner (SUSS MA-6) Wafer Bonder (SUSS SB6-8E)

Vacuum Deposition

E-Beam 1 (Sharon) E-Beam 2 (Custom) E-Beam 3 (Temescal) E-Beam 4 (CHA) Sputter 1 (Custom) Sputter 2 (SFI Endeavor) Sputter 3 Sputter 4

Sputter 5 (Lesker AXXIS) PECVD 1 PECVD 2 (Advanced Vacuum) Unaxis VLR ICP-PECVD IBD Molecular Vapor Deposition Atomic Layer Deposision (Oxford Flexal)

Dry Etch

RIE 1 RIE 2 RIE 3 RIE 5 Si Deep RIE Ashers Unaxis VLR ICP-Etch

ICP Etch 1 ICP Etch 2 UV Ozone Reactor Plasma Clean XeF2 Etch Plasma Activation Tool

Wet Processing

• Wet Benches
• Gold Plating Bench
• Critical Point Dryer
• Spin Rinse Dryer

Thermal Processing

• Rapid Thermal Processor
• Strip Annealer
• Tube Furnace (Tystar 8300)
• Tube Furnace Wafer Bonding (Thermco)
• Tube Furnace AlGaAs Oxidation (Linberg)

Packaging

• Flip-Chip Bonder
• Vacuum Sealer
• Dicing Saw

Inspection, Test and Characterization

• Field Emission SEM 1
• Field Emission SEM 2
• Step Profile
• Step Profilometer
• Ellipsometer
• Microscopes
• Probe Station & Curve Tracer
• Optical Film Thickness (Filmetrics)
• Scanning Probe Microscope
• Tencor Flexus Film Stress
• Optical Film Thickness (Nanometric)
• SEM Sample Coater
• Surface Analysis
• Photo-emission & IR Microscope
• Ellipsometer (Woollam)
• Goniometer
• 4-Point Probe Resistivity Mapper