Tool List: Difference between revisions

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{|
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|-valign="top"
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* [[E-Beam 1 (Sharon)]]
* [[E-Beam 1 (Sharon)]]
* [[E-Beam 2 (Custom)]]
* [[E-Beam 2 (Custom)]]
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* [[Sputter 1 (Custom)]]
* [[Sputter 1 (Custom)]]
* [[Sputter 2 (SFI Endeavor)]]
* [[Sputter 2 (SFI Endeavor)]]
* [[Sputter 3]]
* [[Sputter 3 (AJA)]]
* [[Sputter 4]]
* [[Sputter 4 (AJA)]]
⚫
|width=200|
* [[Sputter 5 (Lesker AXXIS)]]
* [[Sputter 5 (Lesker AXXIS)]]
⚫
|width=400|
* [[PECVD 1]]
* [[PECVD 1 (PlasmTherm 790)]]
* [[PECVD 2 (Advanced Vacuum)]]
* [[PECVD 2 (Advanced Vacuum)]]
* [[Thermal Evap 1]]
* [[Thermal Evap 2]]
* [[Unaxis VLR ICP-PECVD]]
* [[Unaxis VLR ICP-PECVD]]
* [[Ion Beam Deposition (Veeco NEXUS)]]
* [[IBD]]
* [[Molecular Vapor Deposition]]
* [[Molecular Vapor Deposition]]
* [[Atomic Layer Deposision (Oxford Flexal)]]
* [[Atomic Layer Deposision (Oxford Flexal)]]

Revision as of 19:47, 28 June 2012

Lithography

Vacuum Deposition

Dry Etch

Wet Processing

Thermal Processing

Packaging

Inspection, Test and Characterization

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