Tool List: Difference between revisions
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* [[RIE 1]] |
* [[RIE 1 (Custom)]] |
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* [[RIE 2]] |
* [[RIE 2 (MRC)]] |
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* [[RIE 3]] |
* [[RIE 3 (MRC)]] |
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* [[RIE 5]] |
* [[RIE 5 (PlasmaTherm SLR)]] |
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* [[Si Deep RIE]] |
* [[Si Deep RIE (Bosch Etch)]] |
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* [[Ashers]] |
* [[Ashers (Technics PEII]] |
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* [[Unaxis VLR ICP-Etch]] |
* [[Unaxis VLR ICP-Etch]] |
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* [[ICP Etch 1]] |
* [[ICP Etch 1 (Panasonic E620)]] |
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* [[ICP Etch 2]] |
* [[ICP Etch 2 (Panasonic E626)]] |
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* [[UV Ozone Reactor]] |
* [[UV Ozone Reactor]] |
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* [[Plasma Clean]] |
* [[Plasma Clean (Gasonics 2000)]] |
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* [[XeF2 Etch]] |
* [[XeF2 Etch (Xetch)]] |
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* [[Plasma Activation Tool]] |
* [[Plasma Activation Tool (EVG 810)]] |
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* [[HF Vapor Etch]] |
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Revision as of 19:50, 28 June 2012
Lithography
Vacuum Deposition
Dry Etch
Wet Processing
Thermal Processing
- Rapid Thermal Processor
- Strip Annealer
- Tube Furnace (Tystar 8300)
- Tube Furnace Wafer Bonding (Thermco)
- Tube Furnace AlGaAs Oxidation (Linberg)
Packaging
Inspection, Test and Characterization
- Field Emission SEM 1
- Field Emission SEM 2
- Step Profile
- Step Profilometer
- Ellipsometer
- Microscopes
- Probe Station & Curve Tracer
- Optical Film Thickness (Filmetrics)
- Scanning Probe Microscope
- Tencor Flexus Film Stress
- Optical Film Thickness (Nanometric)
- SEM Sample Coater
- Surface Analysis
- Photo-emission & IR Microscope
- Ellipsometer (Woollam)
- Goniometer
- 4-Point Probe Resistivity Mapper