Tool List: Difference between revisions
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=Wet Processing= |
=Wet Processing= |
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* [[Wet Benches]] |
* [[Wet Benches]] |
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**[[Photoresist Spin Benches]] |
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**[[Lithography Development & Solvent Clean Benches]] |
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**[[Wet Etch Benches]] |
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* [[Scales]] |
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** [[Wet Etch Wafer Scale]] |
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** [[Solvent Processing Wafer Scale]] |
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* [[Gold Plating Bench]] |
* [[Gold Plating Bench]] |
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* [[Critical Point Dryer]] |
* [[Critical Point Dryer]] |
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* [[Spin Rinse Dryer]] |
* [[Spin Rinse Dryer (SemiTool)]] |
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* [[Chemical-Mechanical Polisher (Logitech)]] |
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=Thermal Processing= |
=Thermal Processing= |
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Revision as of 19:53, 28 June 2012
Lithography
Vacuum Deposition
Dry Etch
Wet Processing
- Wet Benches
- Scales
- Gold Plating Bench
- Critical Point Dryer
- Spin Rinse Dryer (SemiTool)
- Chemical-Mechanical Polisher (Logitech)
Thermal Processing
- Rapid Thermal Processor
- Strip Annealer
- Tube Furnace (Tystar 8300)
- Tube Furnace Wafer Bonding (Thermco)
- Tube Furnace AlGaAs Oxidation (Linberg)
Packaging
Inspection, Test and Characterization
- Field Emission SEM 1
- Field Emission SEM 2
- Step Profile
- Step Profilometer
- Ellipsometer
- Microscopes
- Probe Station & Curve Tracer
- Optical Film Thickness (Filmetrics)
- Scanning Probe Microscope
- Tencor Flexus Film Stress
- Optical Film Thickness (Nanometric)
- SEM Sample Coater
- Surface Analysis
- Photo-emission & IR Microscope
- Ellipsometer (Woollam)
- Goniometer
- 4-Point Probe Resistivity Mapper