Tool List: Difference between revisions

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=Dry Etch=
= Dry Etch =

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* [[RIE 1 (Custom)]]
*[[RIE 1 (Custom)]]
* [[RIE 2 (MRC)]]
*[[RIE 2 (MRC)]]
* [[RIE 3 (MRC)]]
*[[RIE 3 (MRC)]]
* [[RIE 5 (PlasmaTherm SLR)]]
*[[RIE 5 (PlasmaTherm SLR)]]
* [[Si Deep RIE (Bosch Etch)]]
*[[Si Deep RIE (Bosch Etch)]]
* [[Ashers (Technics PEII]]
*[[Ashers (Technics PEII]]
* [[Unaxis VLR ICP-Etch]]
*[[Unaxis VLR ICP-Etch]]

|width=400|
| width="400" |
* [[ICP Etch 1 (Panasonic E620)]]
* [[ICP Etch 2 (Panasonic E626)]]
*[[ICP Etch 1 (Panasonic E620)]]
*[[ICP Etch 2 (Panasonic E626)]]
* [[UV Ozone Reactor]]
*[[UV Ozone Reactor]]
* [[Plasma Clean (Gasonics 2000)]]
* [[XeF2 Etch (Xetch)]]
*[[Plasma Clean (Gasonics 2000)]]
*[[XeF2 Etch (Xetch)|XeF<sub>2</sub> Etch (Xetch)]]
* [[Plasma Activation Tool (EVG 810)]]
*[[Plasma Activation Tool (EVG 810)]]
* [[HF Vapor Etch]]
*[[HF Vapor Etch]]
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Revision as of 03:43, 1 July 2012

Lithography

Vacuum Deposition

Dry Etch

Wet Processing

Thermal Processing

Packaging

Inspection, Test and Characterization