Tool List: Difference between revisions
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=Vacuum Deposition= |
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{| |
{| |
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|-valign="top" |
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|width=300| |
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*[[E-Beam 1 (Sharon)]] |
* [[E-Beam 1 (Sharon)]] |
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*[[E-Beam 2 (Custom)]] |
* [[E-Beam 2 (Custom)]] |
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*[[E-Beam 3 (Temescal)]] |
* [[E-Beam 3 (Temescal)]] |
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*[[E-Beam 4 (CHA)]] |
* [[E-Beam 4 (CHA)]] |
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*[[Sputter 1 (Custom)]] |
* [[Sputter 1 (Custom)]] |
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*[[Sputter 2 (SFI Endeavor)]] |
* [[Sputter 2 (SFI Endeavor)]] |
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*[[Sputter 3 ( |
* [[Sputter 3 (AJA)]] |
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*[[Sputter 4 ( |
* [[Sputter 4 (AJA)]] |
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*[[Sputter 5 (Lesker AXXIS)]] |
* [[Sputter 5 (Lesker AXXIS)]] |
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⚫ | |||
⚫ | |||
⚫ | |||
*[[PECVD |
* [[PECVD 2 (Advanced Vacuum)]] |
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* [[Thermal Evap 1]] |
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⚫ | |||
*[[Thermal Evap |
* [[Thermal Evap 2]] |
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*[[ |
* [[Unaxis VLR ICP-PECVD]] |
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* [[Ion Beam Deposition (Veeco NEXUS)]] |
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*[[Unaxis VLR ICP-PECVD]] |
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*[[ |
* [[Molecular Vapor Deposition]] |
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⚫ | |||
*[[Molecular Vapor Deposition]] |
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|- |
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| width="400" | |
| width="400" | |
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*[[ICP Etch 1 (Panasonic |
*[[ICP Etch 1 (Panasonic E620)]] |
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*[[ICP Etch 2 (Panasonic |
*[[ICP Etch 2 (Panasonic E626)]] |
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*[[UV Ozone Reactor]] |
*[[UV Ozone Reactor]] |
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*[[Plasma Clean (Gasonics 2000)]] |
*[[Plasma Clean (Gasonics 2000)]] |
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* [[Optical Film Thickness (Nanometric)]] |
* [[Optical Film Thickness (Nanometric)]] |
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* [[Scanning Probe Microscope (Veeco NanoMan)]] |
* [[Scanning Probe Microscope (Veeco NanoMan)]] |
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* [[ Surfscan 6200]] |
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|width=400| |
|width=400| |
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* [[Tencor Flexus Film Stress]] |
* [[Tencor Flexus Film Stress]] |
Revision as of 22:31, 9 July 2012
Lithography
Vacuum Deposition
Dry Etch
Wet Processing
Thermal Processing
- Rapid Thermal Processor (AET RX6)
- Strip Annealer
- Tube Furnace (Tystar 8300)
- Tube Furnace Wafer Bonding (Thermco)
- Tube Furnace AlGaAs Oxidation (Linberg)