Tool List: Difference between revisions
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=Dry Etch= |
= Dry Etch = |
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|-valign="top" |
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|width=300| |
| width="300" | |
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* |
*[[RIE 1 (Custom)]] |
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* |
*[[RIE 2 (MRC)]] |
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* |
*[[RIE 3 (MRC)]] |
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*[[RIE 5 (PlasmaTherm SLR)]] |
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*[[Si Deep RIE (Bosch Etch)]] |
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*[[Ashers (Technics PEII]] |
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*[[Unaxis VLR ICP-Etch]] |
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|width=400| |
| width="400" | |
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⚫ | |||
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*[[ICP Etch 1 (Panasonic E620)]] |
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⚫ | |||
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*[[UV Ozone Reactor]] |
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* [[Plasma Clean (Gasonics 2000)]] |
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*[[Plasma Clean (Gasonics 2000)]] |
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*[[XeF2 Etch (Xetch)|XeF<sub>2</sub> Etch (Xetch)]] |
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*[[Plasma Activation Tool (EVG 810)]] |
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*[[HF Vapor Etch]] |
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Revision as of 03:43, 1 July 2012
Lithography
Vacuum Deposition
Dry Etch
Wet Processing
Thermal Processing
- Rapid Thermal Processor (AET RX6)
- Strip Annealer
- Tube Furnace (Tystar 8300)
- Tube Furnace Wafer Bonding (Thermco)
- Tube Furnace AlGaAs Oxidation (Linberg)