Tool List: Difference between revisions

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=Vacuum Deposition=
= Vacuum Deposition =

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{|
|-valign="top"
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|width=300|
| width="300" |
* [[E-Beam 1 (Sharon)]]
*[[E-Beam 1 (Sharon)]]
* [[E-Beam 2 (Custom)]]
*[[E-Beam 2 (Custom)]]
* [[E-Beam 3 (Temescal)]]
*[[E-Beam 3 (Temescal)]]
* [[E-Beam 4 (CHA)]]
*[[E-Beam 4 (CHA)]]
* [[Sputter 1 (Custom)]]
*[[Sputter 1 (Custom)]]
* [[Sputter 2 (SFI Endeavor)]]
*[[Sputter 2 (SFI Endeavor)]]
* [[Sputter 3 (AJA 2000-F)]]
*[[Sputter 3 (ATC 2000-F)]]
* [[Sputter 4 (AJA 2200-V)]]
*[[Sputter 4 (ATC 2200-V)]]
* [[Sputter 5 (Lesker AXXIS)]]
*[[Sputter 5 (Lesker AXXIS)]]

|width=400|
| width="400" |
* [[PECVD 1 (PlasmaTherm 790)]]
* [[PECVD 2 (Advanced Vacuum)]]
*[[PECVD 1 (PlasmaTherm 790)]]
*[[PECVD 2 (Advanced Vacuum)]]
* [[Thermal Evap 1]]
* [[Thermal Evap 2]]
*[[Thermal Evap 1]]
* [[Unaxis VLR ICP-PECVD]]
*[[Thermal Evap 2]]
*[[Unaxis VLR ICP-PECVD]]
* [[Ion Beam Deposition (Veeco NEXUS)]]
* [[Molecular Vapor Deposition]]
*[[Ion Beam Deposition (Veeco NEXUS)]]
*[[Molecular Vapor Deposition]]
* [[Atomic Layer Deposision (Oxford FlexAL)]]
*[[Atomic Layer Deposision (Oxford FlexAL)]]
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Revision as of 20:14, 9 July 2012

Lithography

Vacuum Deposition

Dry Etch

Wet Processing

Thermal Processing

Packaging

Inspection, Test and Characterization