Tool List: Difference between revisions
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* [[Stepper 3 (ASML)]] |
* [[Stepper 3 (ASML)]] |
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* [[E-Beam Lithography System (JEOL JBX-6300FS)]] |
* [[E-Beam Lithography System (JEOL JBX-6300FS)]] |
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* [[Nano-Imprint |
* [[Nano-Imprint (Nanonex NX2000)]] |
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* [[Contact Aligner (SUSS MA-6)]] |
* [[Contact Aligner (SUSS MA-6)]] |
||
* [[Wafer Bonder (SUSS SB6-8E)]] |
* [[Wafer Bonder (SUSS SB6-8E)]] |
Revision as of 13:58, 11 July 2012
Lithography
Vacuum Deposition
Dry Etch
Wet Processing
Thermal Processing
- Rapid Thermal Processor (AET RX6)
- Strip Annealer
- Tube Furnace (Tystar 8300)
- Tube Furnace Wafer Bonding (Thermco)
- Tube Furnace AlGaAs Oxidation (Linberg)