Tool List: Difference between revisions
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*[[E-Beam 3 (Temescal)]] |
*[[E-Beam 3 (Temescal)]] |
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*[[E-Beam 4 (CHA)]] |
*[[E-Beam 4 (CHA)]] |
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*[[Removed]] |
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*[[Sputter 3 (AJA ATC 2000-F)]] |
*[[Sputter 3 (AJA ATC 2000-F)]] |
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*[[Sputter 4 (AJA ATC 2200-V)]] |
*[[Sputter 4 (AJA ATC 2200-V)]] |
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*[[Sputter 5 ( |
*[[Sputter 5 (AJA ATC 2200-V)]] |
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Revision as of 21:08, 1 May 2018
Lithography
You can see our available photoresists on the Chemical Datasheets page.
Vacuum Deposition
Dry Etch
Wet Processing
See the Chemical List page for stocked chemicals such as Developers, Etchants, Solvents etc.
Thermal Processing
- Rapid Thermal Processor (AET RX6)
- Strip Annealer
- Tube Furnace (Tystar 8300)
- Tube Furnace Wafer Bonding (Thermco)
- Tube Furnace AlGaAs Oxidation (Linberg)
- Wafer Bonder (SUSS SB6-8E)
- Ovens 1, 2 & 3 (Labline)
- Oven 4 (Fisher)
- Oven 5 (Labline)
- High Temp Oven (Blue M)
- Vacuum Oven (YES)