Tool List: Difference between revisions
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* [[Dicing Saw (ADT)]] |
* [[Dicing Saw (ADT)]] |
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* [[Wire Saw (Takatori)]] |
* [[Wire Saw (Takatori)]] |
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* [[Wafer Bonder (SUSS SB6-8E)]] |
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=Inspection, Test and Characterization= |
=Inspection, Test and Characterization= |
Revision as of 14:01, 11 July 2012
Lithography
Vacuum Deposition
Dry Etch
Wet Processing
Thermal Processing
- Rapid Thermal Processor (AET RX6)
- Strip Annealer
- Tube Furnace (Tystar 8300)
- Tube Furnace Wafer Bonding (Thermco)
- Tube Furnace AlGaAs Oxidation (Linberg)
Packaging
- Flip-Chip Bonder (Finetech)
- Vacuum Sealer
- Dicing Saw (ADT)
- Wire Saw (Takatori)
- Wafer Bonder (SUSS SB6-8E)