Tool List: Difference between revisions
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*[[Si Deep RIE (PlasmaTherm/Bosch Etch)]] |
*[[Si Deep RIE (PlasmaTherm/Bosch Etch)]] |
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*[[Ashers (Technics PEII)]] |
*[[Ashers (Technics PEII)]] |
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*[[ |
*[[UV Ozone Reactor]] |
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| width="400" | |
| width="400" | |
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*[[ICP Etch 1 (Panasonic E626I)]] |
*[[ICP Etch 1 (Panasonic E626I)]] |
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*[[ICP Etch 2 (Panasonic E640)]] |
*[[ICP Etch 2 (Panasonic E640)]] |
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*[[ |
*[[ICP-Etch (Unaxis VLR)]] |
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*[[Plasma Clean (Gasonics 2000)]] |
*[[Plasma Clean (Gasonics 2000)]] |
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*[[XeF2 Etch (Xetch)|XeF<sub>2</sub> Etch (Xetch)]] |
*[[XeF2 Etch (Xetch)|XeF<sub>2</sub> Etch (Xetch)]] |
Revision as of 14:51, 11 July 2012
Lithography
Vacuum Deposition
Dry Etch
Wet Processing
Thermal Processing
- Rapid Thermal Processor (AET RX6)
- Strip Annealer
- Tube Furnace (Tystar 8300)
- Tube Furnace Wafer Bonding (Thermco)
- Tube Furnace AlGaAs Oxidation (Linberg)
Packaging
- Flip-Chip Bonder (Finetech)
- Vacuum Sealer
- Dicing Saw (ADT)
- Wire Saw (Takatori)
- Wafer Bonder (SUSS SB6-8E)