Tool List: Difference between revisions

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*[[Si Deep RIE (PlasmaTherm/Bosch Etch)]]
*[[Si Deep RIE (PlasmaTherm/Bosch Etch)]]
*[[Ashers (Technics PEII)]]
*[[Ashers (Technics PEII)]]
*[[Unaxis VLR ICP-Etch]]
*[[UV Ozone Reactor]]

| width="400" |
| width="400" |
*[[ICP Etch 1 (Panasonic E626I)]]
*[[ICP Etch 1 (Panasonic E626I)]]
*[[ICP Etch 2 (Panasonic E640)]]
*[[ICP Etch 2 (Panasonic E640)]]
*[[UV Ozone Reactor]]
*[[ICP-Etch (Unaxis VLR)]]
*[[Plasma Clean (Gasonics 2000)]]
*[[Plasma Clean (Gasonics 2000)]]
*[[XeF2 Etch (Xetch)|XeF<sub>2</sub> Etch (Xetch)]]
*[[XeF2 Etch (Xetch)|XeF<sub>2</sub> Etch (Xetch)]]

Revision as of 14:51, 11 July 2012

Lithography

Vacuum Deposition

Dry Etch

Wet Processing

Thermal Processing

Packaging

Inspection, Test and Characterization