Tool List: Difference between revisions
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* [[Photo-emission & IR Microscope (QFI)]] |
* [[Photo-emission & IR Microscope (QFI)]] |
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* [[Ellipsometer (Woollam)]] |
* [[Ellipsometer (Woollam)]] |
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* [[ |
* [[Resistivity Mapper (CDE RESMAP)]] |
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* [[Laser Scanning Confocal M-scope (Olympus LEXT)]] |
* [[Laser Scanning Confocal M-scope (Olympus LEXT)]] |
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* [[Deep UV Optical Microscope (Olympus)]] |
* [[Deep UV Optical Microscope (Olympus)]] |
Revision as of 18:45, 11 July 2012
Lithography
Vacuum Deposition
Dry Etch
Wet Processing
Thermal Processing
- Rapid Thermal Processor (AET RX6)
- Strip Annealer
- Tube Furnace (Tystar 8300)
- Tube Furnace Wafer Bonding (Thermco)
- Tube Furnace AlGaAs Oxidation (Linberg)
Packaging
- Dicing Saw (ADT)
- Flip-Chip Bonder (Finetech)
- Vacuum Sealer
- Wafer Bonder (SUSS SB6-8E)
- Wire Saw (Takatori)