Tool List: Difference between revisions
Jump to navigation
Jump to search
m (Protected "Tool List" ([edit=sysop] (indefinite) [move=sysop] (indefinite))) |
No edit summary |
||
Line 97: | Line 97: | ||
* [[Tube Furnace Wafer Bonding (Thermco)]] |
* [[Tube Furnace Wafer Bonding (Thermco)]] |
||
* [[Tube Furnace AlGaAs Oxidation (Linberg)]] |
* [[Tube Furnace AlGaAs Oxidation (Linberg)]] |
||
⚫ | |||
=Packaging= |
=Packaging= |
||
Line 102: | Line 103: | ||
* [[Flip-Chip Bonder (Finetech)]] |
* [[Flip-Chip Bonder (Finetech)]] |
||
* [[Vacuum Sealer]] |
* [[Vacuum Sealer]] |
||
⚫ | |||
* [[Wire Saw (Takatori)]] |
* [[Wire Saw (Takatori)]] |
||
Revision as of 20:02, 18 July 2012
Lithography
Vacuum Deposition
Dry Etch
Wet Processing
Thermal Processing
- Rapid Thermal Processor (AET RX6)
- Strip Annealer
- Tube Furnace (Tystar 8300)
- Tube Furnace Wafer Bonding (Thermco)
- Tube Furnace AlGaAs Oxidation (Linberg)
- Wafer Bonder (SUSS SB6-8E)