Tool List: Difference between revisions

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m (Protected "Tool List" ([edit=sysop] (indefinite) [move=sysop] (indefinite)))
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* [[Tube Furnace Wafer Bonding (Thermco)]]
* [[Tube Furnace Wafer Bonding (Thermco)]]
* [[Tube Furnace AlGaAs Oxidation (Linberg)]]
* [[Tube Furnace AlGaAs Oxidation (Linberg)]]
* [[Wafer Bonder (SUSS SB6-8E)]]


=Packaging=
=Packaging=
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* [[Flip-Chip Bonder (Finetech)]]
* [[Flip-Chip Bonder (Finetech)]]
* [[Vacuum Sealer]]
* [[Vacuum Sealer]]
* [[Wafer Bonder (SUSS SB6-8E)]]
* [[Wire Saw (Takatori)]]
* [[Wire Saw (Takatori)]]



Revision as of 20:02, 18 July 2012

Lithography

Vacuum Deposition

Dry Etch

Wet Processing

Thermal Processing

Packaging

Inspection, Test and Characterization