Tool List: Difference between revisions
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(→Lithography: link to available PRs) |
Reynolds t (talk | contribs) |
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*[[E-Beam 3 (Temescal)]] |
*[[E-Beam 3 (Temescal)]] |
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*[[E-Beam 4 (CHA)]] |
*[[E-Beam 4 (CHA)]] |
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*[[Blank]] |
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*[[Sputter 2 (SFI Endeavor)]] |
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*[[Sputter 3 (AJA ATC 2000-F)]] |
*[[Sputter 3 (AJA ATC 2000-F)]] |
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*[[Sputter 4 (AJA ATC 2200-V)]] |
*[[Sputter 4 (AJA ATC 2200-V)]] |
Revision as of 23:58, 2 April 2018
Lithography
You can see our available photoresists on the Chemical Datasheets page.
Vacuum Deposition
Dry Etch
Wet Processing
Thermal Processing
- Rapid Thermal Processor (AET RX6)
- Strip Annealer
- Tube Furnace (Tystar 8300)
- Tube Furnace Wafer Bonding (Thermco)
- Tube Furnace AlGaAs Oxidation (Linberg)
- Wafer Bonder (SUSS SB6-8E)
- Ovens 1, 2 & 3 (Labline)
- Oven 4 (Fisher)
- Oven 5 (Labline)
- High Temp Oven (Blue M)
- Vacuum Oven (YES)