Tool List: Difference between revisions
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*[[Flip-Chip Bonder (Finetech)]] |
*[[Flip-Chip Bonder (Finetech)]] |
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*[[Vacuum Sealer]] |
*[[Vacuum Sealer]] |
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*[[Wire Saw (Takatori)]] |
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=Inspection, Test and Characterization= |
=Inspection, Test and Characterization= |
Revision as of 17:15, 28 October 2021
Lithography
Photoresists and Lithography ChemicalsContact Aligners (Optical Exposure)Direct-Write Lithography
Other Patterning Systems |
Steppers (Optical Exposure)Thermal Processing for Photolithography
Lithography Support
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Vacuum Deposition
Physical Vapor Deposition (PVD)
Sputter Deposition |
Chemical Vapor Deposition (CVD) |
Dry Etch
Reactive Ion Etching (RIE)Plasma Etching and Cleaning
Etch Monitoring
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ICP-RIE
Ion Milling and Reactive Ion Beam EtchingOther Dry Etching |
Wet Processing
See the Chemical List page for stocked chemicals such as Developers, Etchants, Solvents etc.
Thermal Processing
Packaging
Inspection, Test and Characterization
Optical Microscopy
Electron MicroscopyTopographical Metrology |
Thin-Film/Material AnalysisThickness + Optical Constants
Other PropertiesElectrical AnalysisOther Tools
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