Tool List: Difference between revisions
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*[[Sputter 1 (Custom)]] |
*[[Sputter 1 (Custom)]] |
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*[[Sputter 2 (SFI Endeavor)]] |
*[[Sputter 2 (SFI Endeavor)]] |
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*[[Sputter 3 (ATC 2000-F)]] |
*[[Sputter 3 (AJA ATC 2000-F)]] |
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*[[Sputter 4 (ATC 2200-V)]] |
*[[Sputter 4 (AJA ATC 2200-V)]] |
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*[[Sputter 5 (Lesker AXXIS)]] |
*[[Sputter 5 (Lesker AXXIS)]] |
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Revision as of 15:58, 11 July 2012
Lithography
Vacuum Deposition
Dry Etch
Wet Processing
Thermal Processing
- Rapid Thermal Processor (AET RX6)
- Strip Annealer
- Tube Furnace (Tystar 8300)
- Tube Furnace Wafer Bonding (Thermco)
- Tube Furnace AlGaAs Oxidation (Linberg)
Packaging
- Flip-Chip Bonder (Finetech)
- Vacuum Sealer
- Dicing Saw (ADT)
- Wire Saw (Takatori)
- Wafer Bonder (SUSS SB6-8E)