Tool List: Difference between revisions
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=Lithography= |
=Lithography= |
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* [[Suss Aligners (SUSS MJB-3)]] |
* [[Suss Aligners (SUSS MJB-3)]] |
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* [[IR Aligner (SUSS MJB-3 IR)]] |
* [[IR Aligner (SUSS MJB-3 IR)]] |
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* [[DUV Flood |
* [[DUV Flood Expsaad3 (Labline)]] |
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* [[Ovens 1, 2 & 3 (Labline)]] |
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* [[Oven 4 (Fisher)]] |
* [[Oven 4 (Fisher)]] |
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* [[High Temp Oven (Blue M)]] |
* [[High Temp Oven (Blue M)]] |
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Revision as of 22:48, 16 July 2012
Lithography
Vacuum Deposition
Dry Etch
Wet Processing
Thermal Processing
- Rapid Thermal Processor (AET RX6)
- Strip Annealer
- Tube Furnace (Tystar 8300)
- Tube Furnace Wafer Bonding (Thermco)
- Tube Furnace AlGaAs Oxidation (Linberg)
Packaging
- Dicing Saw (ADT)
- Flip-Chip Bonder (Finetech)
- Vacuum Sealer
- Wafer Bonder (SUSS SB6-8E)
- Wire Saw (Takatori)